SDI fabsurplus.com is pleased to announce the availability of the following listed used EVG 820 Dry wafer lamination system.
Please click on the "Get Quote" button at the end of the 820 description, if you'd like to get a quotation, photos and specifications of this Dry wafer lamination system, and your request for this equipment will be forwarded to our SDI sales representatives automatically.
This EVG 820 Dry wafer lamination system is available for immediate sale.
Crating, refurbishment and delivery for this equipment can be quoted on request.
|Description:||Dry wafer lamination system|
|Sales Condition:||as is where is|
The EVG820 Lamination Station is used for automated, stress-free lamination of any kind of dry adhesive film onto a wafer. This unique lamination technology performs punching of the adhesive tape supplied on a roll, followed by alignment and lamination. The Material usually is a double-side adhesive tape, either thermal- or UV- release. With punching technology size and dimension of tape are freely variable and independent from substrate.
Wafer sizes possible: 200 mm and 300 mm.
The data provided herein is not an offer capable of acceptance.
The information contained on this page is, to our knowledge and information, accurate, but it may contain errors and therefore we do not warrant the completeness or accuracy of the information contained on this page.
Any offer by you to purchase the equipment described on this page shall be subject to our standard terms and conditions of sale.
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SDI-Fabsurplus Srl Italy, and SDI-FABSURPLUS LLC. N. America
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