KLA 2367 Brightfield wafer defect inspection system for Sale

SDI fabsurplus.com is pleased to announce the availability of the following listed used KLA 2367 Brightfield wafer defect inspection system.
Please click on the "Get Quote" button at the end of the 2367 description, if you'd like to get a quotation, photos and specifications of this Brightfield wafer defect inspection system, and your request for this equipment will be forwarded to our SDI sales representatives automatically.
This KLA 2367 Brightfield wafer defect inspection system is available for immediate sale.
Crating, refurbishment and delivery for this equipment can be quoted on request.

KLA 2367 Equipment Details

SDI ID: 109562
Manufacturer: KLA
Model: 2367
Description: Brightfield wafer defect inspection system
Version: 200 mm
Vintage: 01.09.2006
Quantity: 1
Sales Condition: as is where is
Lead Time: immediately
Sales Price: Inquire

-Install Type: Stand-Alone
-Please refer to the attached photos to see the details of the tool's current condition.
The 2367 UV/visible brightfield inspection system will allow you to see many types of yield-relevant defects down to the 65nm level.
Throughput is much improved, so you can sample more defects which occur during production.
Data rate is increased by 2x over previous generation brightfield tools.
Low false defects and automatic defect classification algorithms reduce time for SEM review and so allow you to do corrective actions quicker.
Buy doing a UV/DUV mix-and-match strategy with another 28xx inspection system maximises efficiency.
Connects with other KLA-Tencor inspectors and review tools optimize inspector capacity; reduce production integration time; and enable faster, more accurate inspection recipe setup on the SEM
Process Window Qualification application enables detection of systematic defects

Typical Uses:
Critical Pattern Layers (≥65nm): High resolution and noise-suppression technologies produce sensitivity to critical patterning defects, including: lithography CD variations and missing contacts; gate etch stringers; STI voids; and copper CMP corrosion.

Photo Cell Monitoring (PCM): Using the 2367 with optimized test wafers, PCM accelerates learning on lithography processes, helping you to quickly find and eliminate lithography-related micro defects.

After-Develop Inspection (ADI): The 2367 minimizes process-induced noise on photo product wafers, enabling the detection of yield-limiting defects, such as poisoned photoresists, micro-bridges, and resist bubbles.

PWQ: The Process Window Qualification (PWQ) application identifies printed reticle design errors, enabling lithographers to qualify the process window for their designs prior to production.

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The data provided herein is not an offer capable of acceptance.
The information contained on this page is, to our knowledge and information, accurate, but it may contain errors and therefore we do not warrant the completeness or accuracy of the information contained on this page.
Any offer by you to purchase the equipment described on this page shall be subject to our standard terms and conditions of sale.

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