LPKF Vitrion S5000II Laser Induced Deep Etching for Sale

Has CE Mark. Can be inspected by appointment.LIDE Production System for the Semiconductor Industry Available wafer formats: 100 mm/150 mm, 200 mm/300 mm The Vitrion S 5000 system is the production system solution for today's and future packaging and semiconductor applications with the LIDE process. The high-performance laser system processes glass wafers with unparalleled precision and speed, without causing any defects in the glass. It provides perfect quality for the production of through glass vias, for embedding solutions, capping wafers and advanced packaging solutions. The LIDE technology (Laser Induced Deep Etching) developed by LPKF is a new enabling technology for a wide range of applications in microsystems technology. Key specifications at a glance Glass wafer thickness: 0.3 to 3 mm Bridge tool: 150/200 mm wafer or 200/300 mm wafer EFEM: Two standard FOUPs Compatible with flat/notch wafers SECS/GEM for simple integration and configuration SEMI E84 System dimensions (W x H x D): 1800 x 2200 x 3000 mm