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Hitachi S9200 CD SEM for Sale


SDI fabsurplus.com is pleased to announce the availability of the following listed used Hitachi S9200 CD SEM.
Please click on the "Send More Details" button at the end of the S9200 description, if you'd like to get more details, photos and specifications of this CD SEM, and your request for this equipment will be forwarded to our SDI sales representatives automatically.
This Hitachi S9200 CD SEM is available for immediate sale.
Crating, refurbishment and delivery for this equipment can be quoted on request.


Hitachi S9200 Equipment Details

SDI ID: 96550
Manufacturer: Hitachi
Model: S9200
Description: CD SEM
Version: 200 mm
Vintage: 01.03.1999
Quantity: 1
Sales Condition: as is where is
Lead Time: immediately
Sales Price: 340,000 USD
Comments:

-In Operational Condition. Fillted with dual 200 mm Asyst SMIF loaders. See attached photos and a video showing the system loading a wafer and measuring it:-

MP4 VIDEO SHOWING THE CD SEM IN OPERATION

(1) General

Wafer size : 200 or 150mm wafer, orientation flat or V-notch wafer of SEMI or JEIDA standards is applicable.

Principle of CD measurement : Cursor and line profile measurement

CD measurement range : 0.1 to 2.0μm

CD measurement reproducibility : ±1% or 3nm (3 sigma), whichever larger

Throughput : S-9220; 56 wafers/hr (in continuous measurement via

recipe, under Hitachi standard test conditions)

S-9200; 45 wafers/hr (in continuous measurement via

recipe, under Hitachi standard test conditions)

Measured points; 1 point/chip, 5 chips/wafer

Secondary electron image resolution : 3nm(at accelerating voltage of 0.8kV; with reference

specimen for resolution measurement)

Image magnification : SEM image; x500 to x300,000 (CD measurement

Reproducibility guarantee range: x40,000 to x200,000,

excluding effects of contamination or charge-up)

Optical microscope image; About x110

 

(2) Specimen Stage

Movement rage : X and Y ; 0 to 200mm

Stage drive : Pulse motor

Control and speed : Positioning control via linear encoder, max.speed 50mm/s

 

(3) Wafer Loader

Wafer transfer from cassette to loader chamber : Auto transfer via wafer transfer robot

Wafer transfer from loader chamber to Stage : Auto evacuation and auto loading

 

(4) Wafer transfer robot system : Random access using two cassettes

Wafer detection in cassette : Auto detection via wafer searcher

Chucking method : Vacuum chucking on back of wafer

Orientation flat/V notch detection : Non-contact auto detection via optical sensor

 

(5) Electron Optics

Electron gun : Schottky emission type

Accelerating voltage : 500 to 1600V (variable in 10V steps)

Lens system : Electromagnetic condenser lens system, booster objective lens

Secondary electron detection : Scintillator/Photomultiplier detection system using ExB filter, SE electrons and BSE electrons detected upon switching

Objective lens aperture : Heating type movable aperture

(4 openings selectable outside of column), fine adjustment possible

Scanning coil : 2-stage electromagnetic deflection

Stigma coil : 8-pole electromagnetic type (X, Y axis)

Probe current monitoring : Faraday cup incorporated, with automatic measurement function

Optical microscope : 1.2-mm-square visual field, monochrome image

 

(6) Control and Display System

Viewing control CRT : EWS 21 type monitor, display of SEM and OM images, GUI operation screen, wafer map, measured values, stage coordinates, etc

Scanning modes : TV scan, HR scan, SLOW scan (with auto brightness/contrast function)

Image processing :

(a) Software processing using filtering(standard function)

(b) Hardware processing using DSP(option) 3

Recording :

(a) Video printer output function (option)

(b) Image filing function (option)

Safety device : Equipped with emergency off switch

 

(7) CD Measurement Data Processing System

File storage : Storage function for various setting parameters, Measurement results

Data processing function : Statistics output using worksheet system, output of measured values in real time graph

Printout : 80-character thermal printer

* Hard disk capacity varies with instrument serial no.

 

(8) Evacuation System

Evacuation principle : Full automatic dry & clean evacuation

Vacuum pumps : Ion pump (3 units), turbo molecular pump (2 units),

oil rotary pump (2 units; option)

Safety device : Equipped with protective devices against power failure,

column vacuum level drop, dry air pressure drop, cooling

water flow rate drop

 

(9) Dimensions

Main column unit : 1200(W) x 2000(D) x 1850(H) mm, 1200 kg

Display unit : 600(W) x 1290(D) x 1850(H) mm, 340 kg

Power unit : 535(W) x 870(D) x 1800(H) mm, 380 kg

Rotary pump(option) : 410(W) x 610(D) x 500(H) mm, 35 kg/unit (incl. cover) (Model ESDP12 of Edwards Japna)

360(W) x 640(D) x 520(H) mm, 35 kg/unit (incl. cover)

(Model E2M18 of Edwards Japan)

Cooling water circulator : 400(W) x 450(D) x 600(H) mm, 50 kg

(when using W-5010T of Hitachi Science Systems)

(10) Standard System Composition

Main column unit ······················ 1

Display unit ··························· 1

Power unit ···························· 1

Oil rotary pump (option) ················ 2

Cooling water circulator (option) ········ 1

Standard tools ························ 1 set

Spares and consumables ·············· 1 set

Instruction manual ···················· 1

Generic Specification of the Hitachi S9200 and the Hitachi S9220 CD-SEM

(1) General
Wafer size: 200 or 150mm wafer,
orientation flat or V-notch wafer of SEMI or JEIDA
standards is applicable.
Principle of CD measurement : Cursor and line profile measurement
CD measurement range : 0.1 to 2.0μm
CD measurement reproducibility : ±1% or 3nm (3 sigma), whichever larger
Throughput : S-9220; 56 wafers/hr (in continuous measurement via
recipe, under Hitachi standard test conditions)
S-9200; 45 wafers/hr (in continuous measurement via
recipe, under Hitachi standard test conditions)
Measured points; 1 point/chip, 5 chips/wafer
Secondary electron image resolution
: 3nm(at accelerating voltage of 0.8kV; with reference
specimen for resolution measurement)
Image magnification
: SEM image; x500 to x300,000 (CD measurement
Reproducibility guarantee range: x40,000 to x200,000,
excluding effects of contamination or charge-up)
Optical microscope image; About x110

(2) Specimen Stage
Movement rage : X and Y ; 0 to 200mm
Stage drive : Pulse motor
Control and speed : Positioning control via linear encoder, max.speed 50mm/s

(3) Wafer Loader
Wafer transfer from cassette to
loader chamber: Auto transfer via wafer transfer robot
Wafer transfer from loader chamber to
Stage: Auto evacuation and auto loading

(4) Wafer transfer robot
Random access using two cassettes
Wafer detection in cassette : Auto detection via wafer searcher
Chucking method : Vacuum chucking on back of wafer
Orientation flat/V notch detection : Non-contact auto detection via optical sensor.

(5) Electron Optics
Electron gun : Schottky emission type
Accelerating voltage : 500 to 1600V (variable in 10V steps)
Lens system : Electromagnetic condenser lens system,
booster objective lens
Secondary electron detection : Scintillator/Photomultiplier detection system using ExB filter, SE electrons and BSE electrons detected upon
switching
Objective lens aperture: Heating type movable aperture
(4 openings selectable outside of column), fine adjustment possible
Scanning coil : 2-stage electromagnetic deflection
Stigma coil : 8-pole electromagnetic type (X, Y axis)
Probe current monitoring : Faraday cup incorporated,
with automatic measurement function
Optical microscope: 1.2-mm-square visual field, monochrome image

(6) Control and Display System
Viewing control CRT: EWS 21 type monitor, display of SEM and OM images, GUI
operation screen, wafer map, measured values, stage
coordinates, etc
Scanning modes: TV scan, HR scan, SLOW scan (with auto
brightness/contrast function)
Image processing: (a) Software processing using filtering(standard function)
(b) Hardware processing using DSP(option)
Recording: (a) Video printer output function (option)
(b) Image filing function (option)
Safety device : Equipped with emergency off switch

(7) CD Measurement Data Processing System
File storage : Storage function for various setting parameters, Measurement results
Data processing function : Statistics output using worksheet system, output of
measured values in real time graph
Printout : 80-character thermal printer
Hard disk capacity varies with instrument serial no.

8) Evacuation System
Evacuation principle : Full automatic dry & clean evacuation
Vacuum pumps : Ion pump (3 units), turbo molecular pump (2 units),
oil rotary pump (2 units; option)
Safety device
: Equipped with protective devices against power failure,
column vacuum level drop, dry air pressure drop, cooling
water flow rate drop

(9) Dimensions
Main column unit : 1200(W) x 2000(D) x 1850(H) mm, 1200 kg
Display unit : 600(W) x 1290(D) x 1850(H) mm, 340 kg
Power unit : 535(W) x 870(D) x 1800(H) mm, 380 kg
Rotary pump(option) : 410(W) x 610(D) x 500(H) mm, 35 kg/unit (incl. cover)
360(W) x 640(D) x 520(H) mm, 35 kg/unit (incl. cover)
(Model E2M18 of Edwards Japan)
Cooling water circulator
: 400(W) x 450(D) x 600(H) mm, 50 kg
(when using W-5010T of Hitachi Science Systems)

(10) Standard System Composition
Main column unit ······················ 1
Display unit ··························· 1
Power unit ···························· 1
Oil rotary pump (option) ················ 2
Cooling water circulator (option) ········ 1
Standard tools ························ 1 set
Spares and consumables ·············· 1 set
Instruction manual ···················· 1

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The data provided herein is not an offer capable of acceptance.
The information contained on this page is, to our knowledge and information, accurate, but it may contain errors and therefore we do not warrant the completeness or accuracy of the information contained on this page.
Any offer by you to purchase the equipment described on this page shall be subject to our standard terms and conditions of sale.

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