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QMC DPS-600 LED Die Probing System for Sale


SDI fabsurplus.com is pleased to announce the availability of the following listed used QMC DPS-600 LED Die Probing System.
Please click on the "Send More Details" button at the end of the DPS-600 description, if you'd like to get more details, photos and specifications of this LED Die Probing System, and your request for this equipment will be forwarded to our SDI sales representatives automatically.
This QMC DPS-600 LED Die Probing System is available for immediate sale.
Crating, refurbishment and delivery for this equipment can be quoted on request.


QMC DPS-600 Equipment Details

SDI ID: 96636
Manufacturer: QMC
Model: DPS-600
Description: LED Die Probing System
Version: Up to 6 inch
Vintage: 01.12.2011
Quantity: 1
Sales Condition: as is where is
Lead Time: immediately
Sales Price: Inquire
Comments:

-Still installed in the fab. -Shut down and powered off. -Can be inspected by appointemnt. -The equipment is in excellent condition, with no missing parts. -The equipment was lightly used in an R and D environment for around 2-3 years. -The equipment ran 4 inch Sapphire wafers , but other , larger wafer sizes may be possible with this equipment.

QMC DPS-600- System Specification

1. High speed performance and stability for mass production

·        Easy & quick exchange of wafer / BIN ring

·        Quick and quick exchange of blue tape

·        Easy to check & exchange collect and eject with vision system

·        Easy to replace probe card

2. Full automatic operation system

·        Automatic Loading / Unloading wafer from Wafer / BIN cassette

·        Full automatic wafer alignment

·        Automatic level teaching of collect and eject pin

3. High accuracy

·        Increase the accuracy of optical power measurement with 3.3 Inch integrating sphere

·        High sorting accuracy

4. Measurement

·        Electrical characteristic measurement: IF, VF, IR, VR

·        Optical characteristic measurement: Power, Luminous intensity, Spectrum

5. Special illumination machine vision system for PSS or RS wafer

6. Advanced chip defect inspection with machine vision system

Items

Specification

Type of LED

Lateral type LED only

Wafer Size

Up to 6 Inch

Chip Size

300umX300um ~ 1,500umX1500um

Typical Cycle Time

0.21sec/chip (7 measurement items)

Wafer cassette slot

10ea

BIN cassette Slot

64BIN

Sorting Accuracy (X,Y axis)

+/- 30um

Sorting Accuracy (Theta axis)

+/- 3°

System Dimension

1350 X 1250 X 1800 mm (excluding tower lamp)

System weight

800kg approx

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The data provided herein is not an offer capable of acceptance.
The information contained on this page is, to our knowledge and information, accurate, but it may contain errors and therefore we do not warrant the completeness or accuracy of the information contained on this page.
Any offer by you to purchase the equipment described on this page shall be subject to our standard terms and conditions of sale.

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