SDI fabsurplus.com is pleased to announce the availability of the following listed used K&S 6497 Semiautomatic Flip Chip Die Bonder.
Please click on the "Get Quote" button at the end of the 6497 description, if you'd like to get a quotation, photos and specifications of this Semiautomatic Flip Chip Die Bonder, and your request for this equipment will be forwarded to our SDI sales representatives automatically.
This K&S 6497 Semiautomatic Flip Chip Die Bonder is available for immediate sale.
Crating, refurbishment and delivery for this equipment can be quoted on request.
|Description:||Semiautomatic Flip Chip Die Bonder|
|Sales Condition:||as is where is|
±1.2 Mil @ 3 Sigma Placement Accuracy 50 to 3000 grams Bond Force Range 10sq. mil – 1000sq.mil Die Size Range 19” X 12” XY Stage Travel; 0.5”Z Axis Travel; 0.0003” (0.0076 mm) X, Y, Z Resolution 0.2 mrad/motor pulse Theta Rotation
The data provided herein is not an offer capable of acceptance.
The information contained on this page is, to our knowledge and information, accurate, but it may contain errors and therefore we do not warrant the completeness or accuracy of the information contained on this page.
Any offer by you to purchase the equipment described on this page shall be subject to our standard terms and conditions of sale.
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SDI-Fabsurplus Srl Italy, and SDI-FABSURPLUS LLC. N. America
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