Please find below a list of Pre-owned Die and Wire Bonding Equipment for sale by fabsurplus.com . All items are sold in "AS IS , WHERE IS" conditions unless otherwise indicated. Click on any list item to see further data. Items can be provided operational to OEM specifications on request.
| SDI ID | Manufacturer | Model | Description | Version | Vintage | Q. ty | Sales Conditions | Lead Time |
|---|---|---|---|---|---|---|---|---|
| 87475 | ALPHASEM | Swissline 9006 (Spares) | Automatic Epoxy Die Bonder, Parts Tool Only | 200 mm | 01.05.1993 | 1 | as is where is | immediately |
| 100699 | Alphasem | DB 608-PRL | Bonder | Assembly | 01.09.1996 | 1 | as is where is | immediately |
| 83601 | ASM | Extraction and Inspection of the Leadframe | Assembly | 1 | as is where is | immediately | ||
| 83602 | ASM | MC 609H | left:Leadframe in Magazine, transport in one of the ten Ovens, Cooling Station, right side: Leadframe out of Magazine | 1 | as is where is | |||
| 83603 | ASM | IBE 139H | Rotary Station then Buffered in Magazine and from Magazine to Wirebonder | 1 | as is where is | |||
| 83605 | ASM | DS 830 | Double Head Dispenser, left: Magazin, right: Leadframe | 1 | as is where is | |||
| 83606 | ASM | Extraction and Inspection of the Leadframe | 1 | as is where is | ||||
| 83607 | ASM | MC 609H | left:Leadframe in Magazine, transport in one of the ten Ovens, Cooling Station, right side: Leadframe out of Magazine | 1 | as is where is | |||
| 83609 | ASM | SLS 230T | left: IC cup and testing good/bad and than sorting in small tube | 1 | as is where is | |||
| 83610 | ASM | TLB 203EX | Testing | 1 | as is where is | |||
| 83611 | ASM | SLT400 | left: IC cup, Taping on Reel | 1 | as is where is | |||
| 95717 | ASM | AB520A | Wedge Bonder | Assembly | 01.08.2004 | 5 | as is where is | immediately |
| 96391 | ASM | AD830 Plus | Die Bonder | Assembly | 01.06.2013 | 1 | as is where is | immediately |
| 97101 | ASM | AB599A | Wedge Wire Bonder | Assembly | 01.06.2011 | 1 | as is where is | immediately |
| 97102 | ASM | AS899 | Pick and Place Die Bonder | Assembly | 01.06.2009 | 1 | as is where is | immediately |
| 97904 | ASM | AD830 | DIE BONDER | ASSEMBLY | 1 | inquire | ||
| 97906 | ASM | iHawk Xtreme | WIRE BONDER | ASSEMBLY | 3 | inquire | ||
| 97907 | ASM | IS8912DA | DIE BONDER | ASSEMBLY | 1 | inquire | ||
| 99550 | ASM | AD830 | Die Bonder | 01.03.2010 | 1 | inquire | immediately | |
| 100626 | ASM | AD809A-03 | Die Bonder | Assembly | 1 | as is where is | ||
| 100627 | ASM | AD809C-00 | Die Bonder | Assembly | 2 | as is where is | ||
| 100628 | ASM | AD809S-00 | Die Bonder | Assembly | 3 | as is where is | ||
| 101018 | ASM | Eagle 60 | WIRE BONDER | 150 mm | 1 | as is where is | immediately | |
| 102498 | ASM | AD838L | Die Bonder | 01.07.2014 | 1 | as is where is | immediately | |
| 102504 | ASM | AeroLED | Ball Bonder for RGB LED Panels | 01.06.2017 | 1 | as is where is | immediately | |
| 102625 | ASM | IS8912DA | Die Bonder | 01.06.2013 | 1 | as is all rebuilt | ||
| 100632 | Canon | Bestem D02 | Epoxy Die Bonder | Assembly | 1 | as is where is | ||
| 100634 | Datacon | 2210PPS | Die Bonder | Assembly | 2 | as is where is | ||
| 101000 | Datacon | 2200 APM | Flip Chip Bonder | ASSEMBLY | 01.01.2002 | 1 | as is where is | immediately |
| 87819 | Dynatech | DT-SWM1040 | Wafer Mounter 8” | 1 | as is where is | |||
| 68903 | ESEC | 3006 F/X | Fully Automatic Wire bonder | Reliability | 01.06.1999 | 1 | as is where is | immediately |
| 68904 | ESEC | 3088 IP | Wire bonder | Assembly | 01.06.2000 | 1 | as is where is | immediately |
| 72917 | ESEC | 2008 | Die Bonder | 1 | as is where is | immediately | ||
| 73036 | ESEC | 2004APLF | Die Bonder soft solder | 1 | ||||
| 84184 | ESEC | 3088 | WIRE BONDER | Assembly | 1 | as is where is | immediately | |
| 84347 | ESEC | 2005APLF | Refurbished to OEM Specs for TO-220 | 6" | 1 | as is all rebuilt | immediately | |
| 86241 | ESEC | 2008HS3Plus | BONDER | 200 mm | 01.06.2007 | 5 | as is where is | immediately |
| 86708 | ESEC | 2008XP | Refurbished | 1 | as is all rebuilt | immediately | ||
| 90660 | ESEC | 2008 HS PLUS | Bonder | Assembly | 01.06.2003 | 1 | as is where is | immediately |
| 91829 | ESEC | BL-050-N | Parts Loader for Micron 2 Automatic Die Attacher | 1 | inquire | |||
| 91830 | ESEC | BU-050-N | Parts Unloader for Micron 2 Automatic Die Attacher | 1 | inquire | |||
| 99312 | ESEC | ESEC 3006 | Wire Bonder | 01.06.1995 | 1 | as is where is | ||
| 99313 | ESEC | ESEC 3006 | Wire Bonder | 01.06.1997 | 1 | as is where is | ||
| 99314 | ESEC | ESEC 3006 | Wire Bonder | 01.06.1997 | 1 | as is where is | ||
| 99315 | ESEC | ESEC3088 | Wire Bonder | 01.06.2007 | 2 | as is where is | ||
| 100641 | Esec | 2008XP | Die Bonder | Assembly | 4 | as is where is | ||
| 100643 | Esec | 2008XP | Die Bonder | 300 mm | 2 | as is where is | ||
| 100704 | ESEC | 3018 | Gold Ball Bonder | Assembly | 1 | as is where is | immediately | |
| 100705 | ESEC | 3088 | Gold Ball Bonder | Assembly | 1 | as is where is | immediately | |
| 100856 | ESEC | 3088 | Wire Bonder | Assembly | 01.06.2001 | 7 | as is where is | |
| 101849 | ESEC | 2008 hS | Die Bonder | 01.06.2004 | 4 | inquire | immediately | |
| 102598 | EVG | 520 | Manual wafer load substrate Bonder | 150 mm | 01.06.2004 | 1 | as is where is | immediately |
| 101440 | FA Systems Automation | Wire Bond Inspection | Wire bond inspection (3VI/3O) | Assembly | 01.01.2018 | 1 | as is where is | |
| 76327 | Hesse & Knipps | Bondjet 710M | Wedge Bonder | Assembly | 01.06.1998 | 1 | as is where is | immediately |
| 77035 | Hesse & Knipps | Bondjet 710M | Wedge/Wedge Wire Bonder | 1 | as is where is | immediately | ||
| 78849 | HITACHI | CM-700H | BONDER | ASSEMBLY | 01.06.2007 | 1 | inquire | immediately |
| 78850 | HITACHI | CM-700H | BONDER | ASSEMBLY | 01.06.2007 | 1 | inquire | |
| 78851 | HITACHI | CM-700H | BONDER | ASSEMBLY | 01.06.2007 | 1 | inquire | immediately |
| 78852 | HITACHI | CM-700H | BONDER | ASSEMBLY | 01.06.2007 | 1 | inquire | immediately |
| 78853 | HITACHI | CM-700H | BONDER | ASSEMBLY | 01.06.2007 | 1 | inquire | immediately |
| 78854 | HITACHI | CM-700H | BONDER | ASSEMBLY | 01.06.2007 | 1 | inquire | immediately |
| 80339 | Hitachi | CM-700H | DIE Bonder | Assembly | 01.06.2005 | 1 | as is where is | immediately |
| 83744 | HITACHI | CM-700H | BONDER | ASSEMBLY | 01.06.2006 | 1 | inquire | immediately |
| 83745 | HITACHI | CM-700H | BONDER | ASSEMBLY | 01.06.2005 | 1 | inquire | immediately |
| 86290 | Hitachi | CM700H | Die Bonder | Assembly | 01.06.2007 | 3 | as is where is | immediately |
| 87649 | Hitachi | CM-700H | BONDER | ASSEMBLY | 01.06.2007 | 1 | inquire | immediately |
| 88396 | Hitachi | CM700 | Die Bonder | Assembly | 1 | inquire | immediately | |
| 96552 | Hitachi | CM700 | Die Bonder | Assemb;ly | 01.01.2007 | 6 | as is where is | immediately |
| 97860 | HITACHI | DB700SM | Die Bonder | 1 | as is where is | |||
| 97861 | HITACHI | DB700SM | Die Bonder | 1 | as is where is | |||
| 102524 | HITACHI | CM700X | Die Bonder | 01.06.2008 | 4 | inquire | ||
| 102525 | HITACHI | CM700X | Die Bonder | 01.06.2015 | 2 | inquire | ||
| 33630 | K&S | 1471 | Automatic wedge bonder | Assembly | 2 | as is where is | immediately | |
| 91832 | K&S | 1488 Plus | Automatic Gold Ball Bonder | Assembly | 01.06.1997 | 1 | as is where is | immediately |
| 92702 | K&S | MAXUM PLUS | WIRE BONDER | ASSEMBLY | 01.06.2005 | 13 | as is where is | immediately |
| 92703 | K&S | MAXUM ULTRA | WIRE BONDER | ASSEMBLY | 01.06.2007 | 1 | as is where is | immediately |
| 92704 | K&S | MAXUM ULTRA | WIRE BONDER | ASSEMBLY | 01.06.2007 | 1 | as is where is | immediately |
| 96396 | K&S | ATPremier PLUS | Wafer Level Bonder | 200 - 300 mm | 01.08.2017 | 1 | as is where is | immediately |
| 97933 | K&S | Maxum Ultra | WIRE BONDER | ASSEMBLY | 1 | inquire | ||
| 98529 | K&S | 1474 fp | Wire Bonder | Assembly | 1 | as is where is | ||
| 98530 | K&S | Maxum Ultra | Wire Bonder | Assembly | 1 | as is where is | ||
| 99415 | K&S | 6495 | Semiautomatic Epoxy Die Bonder | Assembly | 1 | as is where is | ||
| 99416 | K&S | 6497 | Semiautomatic Flip Chip Die Bonder | Assembly | 1 | as is where is | ||
| 100857 | K&S | PowerFusion | Wedge Bonder | Assembly | 01.06.2015 | 1 | as is where is | |
| 100858 | K&S | PowerFusion | Wedge Bonder | Assembly | 01.06.2015 | 1 | as is where is | |
| 101613 | K&S | 6495 | Semiautomatic Die Bonder | 1 | as is where is | immediately | ||
| 101800 | K&S | Maxum plus (9sets) | Wire bonder | 01.10.2005 | 9 | inquire | ||
| 102257 | Karl Suss | XBC300 | Automated Wafer Bonding Tool | 300 mm | 1 | as is where is | ||
| 71103 | KNS | 8028PPS | Ball Bonder | 1 | ||||
| 62674 | Kulicke-and-Soffa | 4123 | Manual Wedge Wire Bonder | 1 | as is where is | 1 month | ||
| 100714 | LAURIER | DS9100 | DIE SORTER | ASSEMBLY | 1 | as is where is | immediately | |
| 84063 | Leica | MZ 12.5 | Microscope | 1 | as is where is | |||
| 84064 | Leica | MZ 8 | Microscope | 1 | as is where is | immediately | ||
| 84065 | Leica | MZ 6 | Microscope | 1 | as is where is | |||
| 100646 | Longhill | LH860 | Wafer Mounter | Assembly | 1 | as is where is | ||
| 87817 | Okamoto | GNX300P | As-is, no missing parts | 01.01.2001 | 1 | as is where is | ||
| 87818 | Okamoto | VG502MKII8 | 8” Refurbished | 1 | as is where is | |||
| 84830 | Orthodyne | 360C | Heavy wire bonder | Assembly | 1 | as is where is | immediately | |
| 99333 | Orthodyne | M360C | Heavy Wire Bonder | Assembly | 01.06.2002 | 1 | as is where is | immediately |
| 99334 | Orthodyne | M360C | Heavy Wire Bonder | Assembly | 01.06.2002 | 1 | as is where is | |
| 99335 | Orthodyne | M360C | Heavy Wire Bonder | Assembly | 01.06.2003 | 1 | as is where is | immediately |
| 99336 | Orthodyne | M360C | Heavy Wire Bonder | Assembly | 01.06.2003 | 1 | as is where is | immediately |
| 99337 | Orthodyne | M360C | Heavy Wire Bonder | Assembly | 01.06.2003 | 2 | as is where is | immediately |
| 99338 | Orthodyne | M360C | Heavy Wire Bonder | Assembly | 01.06.2003 | 2 | as is where is | immediately |
| 99339 | Orthodyne | M360C | Heavy Wire Bonder | Assembly | 01.06.2003 | 2 | as is where is | immediately |
| 64071 | Panasonic | FCB3 NM-SB50A | Flip Chip Bonder | 150 mm, 200 mm, 300 mm | 01.12.2004 | 1 | as is where is | immediately |
| 87650 | Panasonic | FCB3 | Flip-Chip Bonder | Assembly | 01.06.2006 | 1 | as is where is | immediately |
| 97961 | PANASONIC | DM60M-H | WIDE AREA DIE BONDER | ASSEMBLY | 5 | as is where is | immediately | |
| 100680 | Panasonic | NM-SB50A | Flip Chip Bonder | ASSEMBLY | 2 | as is where is | ||
| 101827 | Research Devices Automation | M-9A | Flip Chip Die Bonder | Assembly | 01.09.2002 | 1 | as is fob | immediately |
| 101984 | SEC | Model 860 Eagle | Flip Chip Bonder | Assembly | 1 | as is where is | ||
| 80348 | Shinkawa | UTC-1000 Super | Wire Bonder | ASSEMBLY | 01.06.2005 | 60 | as is where is | immediately |
| 87647 | SHINKAWA | ACB3000 (LED) | Wire Bonder | Assembly | 01.06.2012 | 1 | as is where is | immediately |
| 87850 | SHINKAWA | COF 300 | Flip Chip Bonder | Assembly | 01.06.2005 | 1 | as is where is | |
| 87851 | SHINKAWA | COF 300 | Flip Chip Bonder | Assembly | 01.06.2005 | 1 | as is where is | |
| 87852 | SHINKAWA | COF 300 | Flip Chip Bonder | Assembly | 01.06.2005 | 1 | as is where is | |
| 87853 | SHINKAWA | COF 300 | Flip Chip Bonder | Assembly | 01.06.2007 | 1 | as is where is | |
| 87854 | SHINKAWA | COF 300 | Flip Chip Bonder | Assembly | 01.06.2007 | 1 | as is where is | |
| 87855 | SHINKAWA | UTC-1000 SUPER | Wire Bonder | Assembly | 01.06.2006 | 1 | as is where is | |
| 87856 | SHINKAWA | UTC-1000 SUPER | Wire Bonder | Assembly | 01.06.2004 | 1 | as is where is | |
| 87857 | SHINKAWA | UTC-1000 SUPER | Wire Bonder | Assembly | 01.06.2005 | 1 | as is where is | |
| 87858 | SHINKAWA | UTC-1000 SUPER | Wire Bonder | Assembly | 01.06.2004 | 1 | as is where is | |
| 87859 | SHINKAWA | UTC-1000 SUPER | Wire Bonder | Assembly | 01.06.2007 | 1 | as is where is | |
| 87860 | SHINKAWA | UTC-1000 SUPER | Wire Bonder | Assembly | 01.06.2006 | 1 | as is where is | |
| 87861 | SHINKAWA | UTC-1000 SUPER | Wire Bonder | Assembly | 01.06.2007 | 1 | as is where is | |
| 87862 | SHINKAWA | UTC-1000 SUPER | Wire Bonder | Assembly | 01.06.2006 | 1 | as is where is | |
| 87863 | SHINKAWA | UTC-1000 SUPER | Wire Bonder | Assembly | 01.06.2006 | 1 | as is where is | |
| 87864 | SHINKAWA | UTC-1000 SUPER | Wire Bonder | Assembly | 01.06.2006 | 1 | as is where is | |
| 87865 | SHINKAWA | UTC-1000 SUPER | Wire Bonder | Assembly | 01.06.2006 | 1 | as is where is | |
| 87866 | SHINKAWA | UTC-1000 SUPER | Wire Bonder | Assembly | 01.06.2006 | 1 | as is where is | |
| 87867 | SHINKAWA | UTC-1000 SUPER | Wire Bonder | Assembly | 01.06.2006 | 1 | as is where is | |
| 87868 | SHINKAWA | UTC-1000 SUPER | Wire Bonder | Assembly | 01.06.2006 | 1 | as is where is | |
| 87869 | SHINKAWA | UTC-1000 SUPER | Wire Bonder | Assembly | 01.06.2006 | 1 | as is where is | |
| 87870 | SHINKAWA | UTC-1000 SUPER | Wire Bonder | Assembly | 01.06.2006 | 1 | as is where is | |
| 87871 | SHINKAWA | UTC-1000 SUPER | Wire Bonder | Assembly | 01.06.2006 | 1 | as is where is | |
| 87872 | SHINKAWA | UTC-1000 SUPER | Wire Bonder | Assembly | 01.06.2006 | 1 | as is where is | |
| 87873 | SHINKAWA | UTC-1000 SUPER | Wire Bonder | Assembly | 01.06.2006 | 1 | as is where is | |
| 87874 | SHINKAWA | UTC-1000 SUPER | Wire Bonder | Assembly | 01.06.2005 | 1 | as is where is | |
| 87875 | SHINKAWA | UTC-1000 SUPER | Wire Bonder | Assembly | 01.06.2005 | 1 | as is where is | |
| 87876 | SHINKAWA | UTC-1000 SUPER | Wire Bonder | Assembly | 01.06.2005 | 1 | as is where is | |
| 87877 | SHINKAWA | UTC-1000 SUPER | Wire Bonder | Assembly | 01.06.2005 | 1 | as is where is | |
| 87878 | SHINKAWA | UTC-1000 SUPER | Wire Bonder | Assembly | 01.06.2005 | 1 | as is where is | |
| 87879 | SHINKAWA | UTC-1000 SUPER | Wire Bonder | Assembly | 01.06.2007 | 1 | as is where is | |
| 87880 | SHINKAWA | UTC-2000 SUPER | Wire Bonder | Assembly | 01.06.2008 | 1 | as is where is | |
| 87881 | SHINKAWA | UTC-2000 SUPER | Wire Bonder | Assembly | 01.06.2008 | 1 | as is where is | |
| 87882 | SHINKAWA | UTC-2000 SUPER | Wire Bonder | Assembly | 01.06.2008 | 1 | as is where is | |
| 87883 | SHINKAWA | UTC-2000 SUPER | Wire Bonder | Assembly | 01.06.2008 | 1 | as is where is | |
| 87884 | SHINKAWA | UTC-2000 SUPER | Wire Bonder | Assembly | 01.06.2008 | 1 | as is where is | |
| 87885 | SHINKAWA | UTC-2000 SUPER | Wire Bonder | Assembly | 01.06.2008 | 1 | as is where is | |
| 87886 | SHINKAWA | UTC-2000 SUPER | Wire Bonder | Assembly | 01.06.2008 | 1 | as is where is | |
| 87887 | SHINKAWA | UTC-2000 SUPER | Wire Bonder | Assembly | 01.06.2008 | 1 | as is where is | |
| 87889 | SHINKAWA | UTC-2000 SUPER | Wire Bonder | Assembly | 01.06.2008 | 1 | as is where is | |
| 87894 | SHINKAWA | UTC-3000WE | Wire Bonder | Assembly | 01.06.2012 | 1 | as is where is | |
| 88398 | Shinkawa | SPA310 | Die Bonder | Assembly | 1 | inquire | immediately | |
| 92434 | Shinkawa | SPA310 | Die Bonder | 1 | inquire | |||
| 94027 | SHINKAWA | SPA-300 SUPER | Die Bonder | Assembly | 01.06.2006 | 1 | as is where is | |
| 94413 | Shinkawa | ACB35 | Wire Bonder Machine | ASSEMBLY | 01.06.2001 | 1 | as is where is | |
| 94414 | Shinkawa | ACB35 | Wire Bonder Machine | ASSEMBLY | 01.06.2000 | 4 | as is where is | |
| 94415 | Shinkawa | ACB35 | Wire Bonder Machine | ASSEMBLY | 01.06.2009 | 3 | as is where is | |
| 94420 | Shinkawa | ACB35 | Wire Bonder Machine | ASSEMBLY | 01.06.2000 | 1 | as is where is | |
| 97971 | SHINKAWA | SPA400 | DIE BONDER | ASSEMBLY | 2 | inquire | ||
| 97974 | SHINKAWA | UTC-2000 Super | WIRE BONDER | ASSEMBLY | 42 | inquire | ||
| 97975 | SHINKAWA | UTC-3000 | WIRE BONDER | ASSEMBLY | 01.04.2012 | 8 | as is where is | immediately |
| 99342 | Shinkawa | ACB35 | Wire Bonder | 01.06.2000 | 1 | as is where is | ||
| 99343 | Shinkawa | ACB35 | Wire Bonder | 01.06.2000 | 4 | as is where is | ||
| 99344 | Shinkawa | ACB35 | Wire Bonder | 01.06.2000 | 3 | as is where is | ||
| 99345 | Shinkawa | ACB400 | Wire Bonder | 01.06.2012 | 1 | as is where is | ||
| 99346 | Shinkawa | ACB400 | Wire Bonder | 01.06.2000 | 4 | as is where is | ||
| 99348 | Shinkawa | UTC1000 | Wire Bonder | 01.06.2002 | 1 | as is where is | ||
| 99349 | Shinkawa | UTC1000 | Wire Bonder | 01.06.2003 | 1 | as is where is | ||
| 99350 | Shinkawa | UTC1000 | Wire Bonder | 01.06.2003 | 0 | as is where is | ||
| 99351 | Shinkawa | UTC1000 | Wire Bonder | 01.06.2003 | 1 | as is where is | ||
| 99352 | Shinkawa | UTC1000 | Wire Bonder | 01.06.2003 | 1 | as is where is | ||
| 99353 | Shinkawa | UTC1000 | Wire Bonder | 01.06.2003 | 1 | as is where is | ||
| 99354 | Shinkawa | UTC1000 | Wire Bonder | 01.06.2003 | 1 | as is where is | ||
| 99355 | Shinkawa | UTC1000 | Wire Bonder | 01.06.2003 | 1 | as is where is | ||
| 99356 | Shinkawa | UTC1000 | Wire Bonder | 01.06.2004 | 1 | as is where is | ||
| 99357 | Shinkawa | UTC1000 | Wire Bonder | 01.06.2004 | 1 | as is where is | ||
| 99358 | Shinkawa | UTC1000 | Wire Bonder | 01.06.2004 | 1 | as is where is | ||
| 99359 | Shinkawa | UTC1000 | Wire Bonder | 01.06.2002 | 1 | as is where is | ||
| 99360 | Shinkawa | UTC1000 | Wire Bonder | 01.06.2004 | 1 | as is where is | ||
| 100045 | Shinkawa | SPA-300 Super | Die Bonder | 01.09.2005 | 22 | as is where is | ||
| 100683 | Shinkawa | SBB410 | Bump Bonder | ASSEMBLY | 1 | as is where is | ||
| 100684 | SHINKAWA | UTC-2000 | Wire Bonder | ASSEMBLY | 1 | as is where is | ||
| 100713 | Shinkawa | SPA300Super | DIE BONDER | Assembly | 2 | as is where is | immediately | |
| 102627 | SHINKAWA | SPA400 | Die Bonder | 01.06.2008 | 7 | as is all rebuilt | ||
| 100751 | Takatori | MWS-610SD | Wire Cutting Machine | 2 | as is where is | |||
| 100752 | Takatori | MWS-812SD | Wire Cutting Machine | 1 | as is where is | |||
| 87374 | TDK | AFM 1561 | Flip-Chip Bonder | Assembly | 01.06.2015 | 14 | as is where is | immediately |
| 102008 | TDK | AFM-1505 | Flip Chip Bonder | Assembly | 01.06.2017 | 1 | as is where is | |
| 102009 | TDK | AFM-1505 | Flip Chip Bonder | Assembly | 01.06.2017 | 1 | as is where is | |
| 102010 | TDK | AFM-1505 | Flip Chip Bonder | Assembly | 01.06.2017 | 1 | as is where is | |
| 102011 | TDK | AFM-1505 | Flip Chip Bonder | Assembly | 01.06.2017 | 1 | as is where is | |
| 102012 | TDK | AFM-1505 | Flip Chip Bonder | Assembly | 01.06.2017 | 1 | as is where is | |
| 102013 | TDK | AFM-1505 | Flip Chip Bonder | Assembly | 01.06.2017 | 1 | as is where is | |
| 102014 | TDK | AFM-1505 | Flip Chip Bonder | Assembly | 01.06.2017 | 1 | as is where is | |
| 96075 | TEL Tokyo Electron | TBDB Synapse Series | coater + bonder + debonder | 300 mm | 1 | inquire | ||
| 99365 | TOSOK | 3310 | Epoxy Die Bonder | 01.06.1998 | 4 | as is where is | ||
| 99366 | TOSOK | DBD 3280/3310 | Die Bonder | 01.06.2000 | 4 | as is where is | ||
| 99367 | TOSOK | DBD3310 | Die Bonder | 01.06.1996 | 14 | as is where is | ||
| 99368 | TOSOK | DBD3310 3280 | Die Bonder | 01.06.1998 | 4 | as is where is | ||
| 99369 | TOSOK | DBD3550R | Die Bonder | 01.06.2001 | 1 | as is where is | ||
| 99370 | TOSOK | DBD3550R | Die Bonder | 01.06.2000 | 1 | as is where is | ||
| 99371 | TOSOK | DBD3550R | Die Bonder | 01.06.2000 | 1 | as is where is | ||
| 99372 | TOSOK | DBD3550R | Die Bonder | 01.06.2003 | 1 | as is where is | ||
| 98532 | Unitek | Micropull III | Bond Pull | Assembly | 1 | as is where is | ||
| 100885 | Various (ASM, Disco, K&S) | Various | Bonders, Molding Press, Dicing Saw | 01.06.2015 | 9 | as is where is | immediately | |
| 101019 | West Bond | 7476E | Wire bonder | wafer size 150 mm | 1 | as is all rebuilt | 2 weeks | |
| 87482 | WEST-BOND | 7200A | Manual Epoxy Die Bonder | Assembly | 1 | as is where is | immediately |