SDI fabsurplus.com is pleased to announce the availability of the following listed used EVG 520 Manual Wafer Load Substrate Bonder.
Please click on the "Send More Details" button at the end of the 520 description, if you'd like to get more details, photos and specifications of this Manual Wafer Load Substrate Bonder, and your request for this equipment will be forwarded to our SDI sales representatives automatically.
This EVG 520 Manual Wafer Load Substrate Bonder is available for immediate sale.
Crating, refurbishment and delivery for this equipment can be quoted on request.
|Description:||Manual Wafer Load Substrate Bonder|
|Sales Condition:||as is where is|
|Lead Time:||2 months|
Fully refurbished, excellent condition.
-Tooling for 6" Wafer inclusive Bond Chuck and Pressure Insert
-Capable of fusion compression bonding
-Capable of thermal compression bonding
-Capable of anodic bonding
-Ideal for R&D and pilot production applications
-High-vacuum capable bond chamber
-Auto opening of bond tool cover
-Windows based control software and operation interface
-Wafer size: up to 150mm capable
-Max Bond Force: 7 kN
-Top side heater: 550°C max. in 1°C steps
-Bottom side heater: 550°C max. in 1°C steps
-Temperature uniformity: ± 1,5 %
-Turbo pump and controller
-System computer, monitor, and keyboard
-PDF Operations Manual for EVG 520 Bonder
The data provided herein is not an offer capable of acceptance.
The information contained on this page is, to our knowledge and information, accurate, but it may contain errors and therefore we do not warrant the completeness or accuracy of the information contained on this page.
Any offer by you to purchase the equipment described on this page shall be subject to our standard terms and conditions of sale.
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