Delvotec 6200 Gold Ball Wire Bonder for Sale

REFURBISHED AND CHECKED BY A SPECIALIST ENGINEER.

Full automatic Goldball Wirebonder for fine wire MCM and Hybrid Applications.
The 6200 family of machines was developed from the successful 6100 series of thermosonic gold ball bonders and offers the best choice for a wide range of commercially and strategically important applications where a truly universal bonder is required.
Linear motor drive systems allow fast, smooth-running operation with accuracy and repeatability in a small footprint.
• X/Y2 motion contained in the head enables rigid clamping of device and simpler design of automatic handling systems
• Pentium TM processor with UNIX based operating system and full network capability
• The basic machine is configured for an 8" x 6" bond area
• All machines use a process tolerant, grey-level pattern recognition system from Cognex
• Red and white light sources available with direct, oblique and diffuse lighting
• Programmable piezo-technology controlled wire clamp unit allows better process control
• Programmable bond weight controlled by linear motor system
• Over 10,000 wires and 200 dice in a single programme
• Step and repeat capability for modular programming
• Component handling can be manual, semi-automatic, fully automatic magazine-to-magazine or with an in-line link to conveyor systems
The family concept with a common hardware and software base allows retrofit of all options at any time but keeps the cost of the initial investment down to an absolute minimum.
 
    Specifications
  Bond area 200 x 150mm
  Z-range 20mm
  Wire diameter 17 to 50um
  Wire feed 2" spool
  Ultrasonic system   60kHz or 100kHz
  Pattern recognition travelling CCD camera and Cognex
  Lighting            3 channels, direct, indirect and side light
  Wire count          > 10,000
  Die count           200 standard
  Control             Pentium processor with UNIX-based operating
                      system
  Programme storage   Hard disk, floppy disk and streamer
  Data transfer       several standard options for export of quality
                      control data;
                      CAD data import optional
  Network capability  TCP/IP network standard built in, allowing
                      remote access for diagnosis, service and
                      software maintenance
  Overall dimensions  58 x 100 x 150cm WxDxH
  Line requirements   100 - 260VAC, 50 - 60Hz, 3kW, single phase
  Air I vacuum        5 bar 550 mm/Hg
  Material Input
  Substrate size      200 x 150mm maximum
  Substrate types     Leadframes, PCBs, boats, carriers etc.
  Component           Manual, semi-automatic, automatic
  handling            magazine to magazine or in-line
                      including temperature controller, 3 heating
                      systems optional
  Operating Data
  Position            better than +/-3um typically
  repeatability
  Bond speed          350ms for 2mm loop typically
 
With rigid heating plates with a width of 170 mm
Working area: 200 x 150 mm
Heated oven/plates    
Microscope