KLA eDR-5200 PLUS Defect Review Sem WITH DEFECT CLASSIFICATION CAPABILITY for Sale

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eDR-5200 Technology Summary
High Resolution Imaging for Classification of less than 50nm Defects
Immersion Column Design
As leading-edge fabs bring 45nm devices into production and investigate the 32nm node,
the need for better resolution is driving an inflection point in defect review and classification.
The eDR-5200 introduces an immersion column design to address the need to image and
classify less than 50nm defects. Bathing the imaged area in a strong electromagnetic field
enables nearly 2X better resolution, analogous to the benefit that immersion lithography
brings to printing smaller features.
Widest Range of Beam Conditions
A broad range of operating conditions is necessary to achieve best resolution on the wide
variety of materials and geometries employed in advanced devices. The 193nm resists are
often the most challenging, requiring soft landing energy to avoid damage to the imaged
layers. The eDR-5200 spans the industry's widest range of beam conditions to best meet
imaging needs for the 45nm node and beyond.
EDX Technology for the 45nm Node
The eDR-5200 employs an innovative EDX design that uses robust, innovative algorithms to
enable analysis and classification of defects less than 100nm in diameter, based on their
composition.
SEM Non-Visual Reduction
Inspector Recipe Tuning
Proprietary connectivity to KLA-Tencor optical inspection systems enables 2X faster, more
accurate inspector recipe development. The inspector's recipe can be set up and optimized
on the eDR-5200 for maximum sensitivity and lower SNV rate, eliminating multiple
transports of the wafer between the systems, and freeing the inspection tool for additional
inspections.High Positioning Accuracy
The eDR-5200 review and classification system is equipped with a high precision stage and
advanced defect de-skewing algorithms. Together these can reduce SNV rates, by
increasing the ability of the SEM review tool to capture less than 50nm defects.
Superior Automatic Defect Location
Low contrast or tiny defects can be completely missed and categorized as SNV by traditional
defect re-detection approaches. The eDR-5200 introduces advanced re-detection methods
which contribute a considerable number of critical yield-limiting defects to the final Pareto.
Recognition of Previous-Layer Defects
Because an electron beam interacts with only the surface of a layer, previous-layer defects
are traditionally classified as SNV. A new approach accessing proprietary optical information
from KLA-Tencor inspection tools allows characterization of previous-layer defects by
displaying their optical image.
Innovative, Production-Worthy Classification
The eDR-5200 provides an innovative approach to defect classification. Set-up free, power
assisted defect classification (ePAC(TM)) and a learn-as-you-go classification engine enable
the user to easily transition from manual classification to fully automated defect classification
(eADC(TM)).
(1) A defect Pareto is a bar graph of defect frequency by type. It is used to make decisions
about what corrective action needs to be taken to reduce defectivity.