AXCELIS M150PC UV Bake for Sale

The Fusion Microlite 150PC Photostabilization
System uses a special pro-cess to harden and
impart high-temperature stability to photoresist
materials on semiconductor wafers.
During the UV/BakeTM process, the wafer is held on
a thermal chuck by vac-uum contact, UV exposure
is initiated, and the temperature is ramped up from
its initial setting to an elevated temperature at a ramp
rate selected by the operator. The process
programming flexibility of the system can be used to
adapt the basic UV/Bake process to a wide variety of
process requirements.

-Still installed and shut down in the fab 
-Was Running wafers Up until May 2025
-Set up for Open 6 inch wafer cassette loading 
-Can be inspected by appointment 
-Configuration and photos are available on request

Convertible to 8 inch wafer size: NO