KLA 2367 Wafer Defect Inspection System for Sale

-Sill installed and running in the cleanroom
-Can be inspected by appointment
-Under OEM service
-Installed Pixel sizes: 0.12 um, 0.62 um and 0.39 um
-Has ORS Upgrade completed
-Configured for  open wafer cassette loading, 200 mm wafers, with 2 cassette loading stations
-Software build Version 10.4.601.0.1
-Software Algo: BL10.4.4348.2489
-Software Blazer: 10.4.507.5P.4792
-Software Cougar: Prod_GSS_OfflineSetup_RT
-Has CE mark

The 2367 UV/visible brightfield inspection system will allow you to see many types of yield-relevant defects down to the 65nm level.
Throughput is much improved, so you can sample more defects which occur during production.
Data rate is increased by 2x over previous generation brightfield tools.
Low false defects and automatic defect classification algorithms reduce time for SEM review and so allow you to do corrective actions quicker.
Buy doing a UV/DUV mix-and-match strategy with another 28xx inspection system maximises efficiency.
Connects with other KLA-Tencor inspectors and review tools optimize inspector capacity; reduce production integration time; and enable faster, more accurate inspection recipe setup on the SEM
Process Window Qualification application enables detection of systematic defects

Typical Uses:

Critical Pattern Layers (≥65nm): High resolution and noise-suppression technologies produce sensitivity to critical patterning defects, including: lithography CD variations and missing contacts; gate etch stringers; STI voids; and copper CMP corrosion.

Photo Cell Monitoring (PCM): Using the 2367 with optimized test wafers, PCM accelerates learning on lithography processes, helping you to quickly find and eliminate lithography-related micro defects.

After-Develop Inspection (ADI): The 2367 minimizes process-induced noise on photo product wafers, enabling the detection of yield-limiting defects, such as poisoned photoresists, micro-bridges, and resist bubbles.

PWQ: The Process Window Qualification (PWQ) application identifies printed reticle design errors, enabling lithographers to qualify the process window for their designs prior to production.

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Cost-effective UV Line Monitoring

With new defect detection challenges created by the integration of new materials, structures, and advanced processes, chipmakers continue to strive for high performance at low cost. The 2367 meets these challenges by enabling high sampling detection of critical defects on FEOL and BEOL layers such as gate etch and copper CMP. With a 2X faster data rate compared to its predecessor, the 2367 is the market’s fastest brightfield inspector.

    2X faster rate increase through new image computer and breakthrough TDI sensor
    Superior material contrast and resolution from selectable broadband illumination modes and high numerical aperture
    Sophisticated algorithms and sensitivity-enhancing technologies to strengthen detection of critical defects
    Low cost of ownership inspection solution through sampling and capture capabilities, and field upgradeability

Comprehensive Defect Detection
The 2367 is part of a portfolio of defect control solutions from KLA-Tencor that can be integrated into a lowest cost of overall inspection strategy. A common UI with the 2800 Series, the Puma 9000 Series, and the eS3x platform means that fab engineers can easily transfer their expertise from one tool to another in the line. Similarly, the 2367 shares recipes with the 2800 and the Puma 9000, enabling a mix-and-match inspection strategy. Backed by a roadmap for continued platform development, the 2367 and its complementary tools can help chipmakers innovate faster to achieve their performance and profitability goals.

-603 CM X 133 CM X 213.5 CM (H).
-WEIGHT 3000 KG