KLA Microsense UMA-C200-STR Thin Film Stress Measurement System Wafer stress measurement for Sale

-This system was purchased new in 2019 for around $900k USD.
-It was used very little, and is in "Like New" condition.
-See attached photos showing the tool before removal.
-It was recently de-installed, and is now warehoused.
-It can be inspected by appointment.
-configured for loading via SEMI standard open cassettes, 150 mm and 200 mm wafers, with 2 load stations.
Measurement capabilities provided:-
- Wafer Thickness
- Average wafer bow and warp, average wafer radius of curvature
- Average wafer film stress
- 2D Local Stress Map with Min and Max values
- 3D Local Stress Map with Min and Max values
- Local Line Stress Profiles with specified orientation, including Min and Max values.
- Exportable data and maps 

Measurement Parameters Accuracy Repeatability One Sigma Display Resolution
Thickness: Center, Minimum, Maximum, Average 0.10um 0.05 um 10 nm
Global Flatness:
TTV 0.05 um 0.05 um 10 nm
TIR
FPD
Local Flatness: 0.05um 0.05 um 10 nm
Local Thickness Variation (LTV)
Local Total Indicator Reading (LTIR)
Local Focal Plane Deviation (LFPD)
Bow and Warp
Bow 0.25 um + 0.5% of reading 10 nm
Warp
Sori

Measurement Throughput (Wph) - full wafer mapping

150 mm / 65 200 MM / 50
Data Analysis
Measurement Parameters: Thickness, TTV, TIR, LTV, Bow, Warp
Wafer Maps: Contour, 3D Surface, Site LTV, Wafer Stress

Wafer Specifications
Diameters: 150mm, 200mm
Diameter Tolerance: +/- 0.5mm
Thickness Range:
Dynamic Range:
Thickness: +/- 150 um
Bow/Warp: +/- 250 um

Surfaces: Sawn, Lapped, Polished
Fiducials: Semi Flat, Notch

System Configuration: 
Wafer Handling: Robotic
[Measurement Positioning: Precision Air Bearing
Pre-aligner: Included
OCR Reader: Optional
SECS/GEM: Optional
Cassette Stations: 2 cassettes standard
Calibration: Automated Reliability (MTBF):10,000