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LPE PE106A Silicon Carbide Epitaxial (EPI) Reactor for Sale


SDI fabsurplus.com is pleased to announce the availability of the following listed used LPE PE106A Silicon Carbide Epitaxial (EPI) Reactor.
Please click on the "Get Quote" button at the end of the PE106A description, if you'd like to get a quotation, photos and specifications of this Silicon Carbide Epitaxial (EPI) Reactor, and your request for this equipment will be forwarded to our SDI sales representatives automatically.
This LPE PE106A Silicon Carbide Epitaxial (EPI) Reactor is available for immediate sale.
Crating, refurbishment and delivery for this equipment can be quoted on request.


LPE PE106A Equipment Details

SDI ID: 118319
Manufacturer: LPE
Model: PE106A
Description: Silicon Carbide Epitaxial (EPI) Reactor
Version: 150 mm
Vintage: 01.06.2024
Quantity: 1
Sales Condition: as is where is
Lead Time: immediately
Sales Price: Inquire
Comments:

This equipment was installed in the fab, but never used. It was de-commissioned by the OEM and removed to warehouse storage in April 2026.
Configuration:
Argon Line
H2 Line
SiHCl3 (Silicon Source) with bubbler and thermal controller
N-type dope line
C2H4 Elylene Carbon Source
(CH3)3Al (Trimethyaluminium)
HCl line
TCS Bubbler Cabinet

Packing List
1. Carriage module
2. Reactor Module
3. Power generator
4. 1 x Trolley for PC
   2 x UPS
   1 x PC and Monitor
   1 x Coaxial cables
   2 x Panel reactor

5. 1 x Set of reactor quartz / graphite

6. 1 x Vacuum Pump Ebara

7. 1 x Bubbler STD Cod. 16G702/R-3061

8. 1 x Thermo Chiller

9. 1 x Reaction Chamber

10. 1 x Cabinet Bubbler

https://www.lpe-epi.com/products/pe1o6a/
SILICON CARBIDE EPITAXIAL REACTOR PE1O6A
GENERAL DESCRIPTION

    Single wafer 150mm epitaxy reactor
    Hot wall inductive heating
    Three-zone gas injection system
    Load lock for inert purge between runs
    Smallest footprint

 
UNMATCHED PROCESS FLEXIBILITY

    Thin , thick and super thick epitaxial layers
    Multilayer (p and n) in one run
    Reduced pressure process capability

 
THROUGHPUT

    Hi temperature robotized handling
    Industry’s shortest heat up / cool down
    High growth rate
    Lowest CoO


    Excellent thickness control <1% and dopant uniformity <2%; 
    High grow rate up to 60 µm/hr; 
    High productivity including long time between preventive maintenance;
    High reliability and repeatability;
    Small compact footprint. 

 
Major applications 

    SiC epitaxy for power device transistors; 
    SiC epitaxy on bare wafers. 

 


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The data provided herein is not an offer capable of acceptance.
The information contained on this page is, to our knowledge and information, accurate, but it may contain errors and therefore we do not warrant the completeness or accuracy of the information contained on this page.
Any offer by you to purchase the equipment described on this page shall be subject to our standard terms and conditions of sale.

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