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| SDI ID | Manufacturer | Model | Description | Version | Vintage | Q. ty | Sales Conditions | Lead Time | |
|---|---|---|---|---|---|---|---|---|---|
| 109581 | EVG | 101 | Photoresist coater and developer | 200 mm | 01.05.2008 | 1 | as is where is | immediately | |
| 108816 | EVG | Smart View | Wafer Aligner - Parts Only | 1 | as is where is | ||||
| 109596 | EVG | 101 | Photoresist Spray Coater | 150 mm | 1 | inquire | |||
| 113957 | EVG | 501 | Wafer Bonder | 150 mm | 1 | inquire | |||
| 113958 | EVG | 620 | Mask Aligner (Upgraded from 420) (TSA & BSA) | 150 mm | 1 | inquire | |||
| 109611 | EVG | 520 | Wafer Bonder | 150 mm | 1 | inquire | |||
| 111732 | EVG | 850DB | Automated Debonding System | 200mm | 1 | as is where is | immediately | ||
| 112763 | EVG | Smartview EV640 | Wafer to Wafer Bond Aligner | 150 - 200 mm | 01.06.2001 | 1 | as is where is | immediately | |
| 112764 | EVG | Smartview Bond Aligner | Wafer to Wafer Bond Aligner | 150 mm to 300 mm | 01.06.2005 | 1 | as is where is | immediately | |
| 116626 | EVG | Gemini | Wafer to Wafer Bonder | 200 mm | 01.06.2012 | 1 | as is where is | immediately | |
| 116652 | EVG | 620 NT | Wafer Bond Alignment System | up to 150 mm | 01.06.2022 | 1 | as is where is | immediately | |
| 116653 | EVG | 520 IS | Wafer Bonding System | up to 150 mm | 01.06.2022 | 1 | as is where is | immediately | |
| 114101 | EVG | 150 | Coat and Develop Track | 150 mm | 1 | as is where is | |||
| 101819 | EVG | 820 | Mold Carrier Lamination System | 200 mm | 1 | as is where is | immediately | ||
| 116677 | EVG | 850 TB | Organic Wafer Bonding , with in-chamber wafer centering | 200 mm | 01.06.2024 | 1 | as is where is | ||
| 116678 | EVG | 850 TB | Organic Wafer Bonding , with in-chamber wafer centering | 200 mm | 01.06.2024 | 1 | as is where is | ||
| 103140 | EVG | 520 | Manual Wafer Load Substrate Bonder | 150 mm | 01.05.2003 | 1 | as is where is | 2 months |