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| SDI ID | Manufacturer | Model | Description | Version | Vintage | Q. ty | Sales Conditions | Lead Time | |
|---|---|---|---|---|---|---|---|---|---|
| 118661 | LASERTEC | BGM300 | Wafer Surface Analyzing and Visualization System | 200 mm | 01.06.2008 | 1 | as is where is | ||
| 113092 | LASERTEC | BGM300 | Wafer Inspection System | 300 mm | 01.06.2014 | 1 | as is where is | immediately | |
| 111456 | MIRAE Corp. | M330H | Handler | 01.01.2009 | 1 | as is where is | immediately | ||
| 116637 | MRSI | M3 | Flip-Chip Die Bonder | Assembly | 01.10.2014 | 2 | as is where is | immediately | |
| 112863 | Neslab | M33 | Chiller | Chiller | 1 | as is where is | |||
| 112864 | Neslab | M33 | Chiller | Chiller | 1 | as is where is | |||
| 109560 | SELA/Camtek | EM3i | Saw for TEM sample preparation | ASSEMBLY | 01.05.2011 | 1 | as is where is | ||
| 109031 | SMT | Max QM3000 | Automatic Pick and Place Machine | SMT | 01.04.2022 | 1 | as is where is | immediately | |
| 108706 | SSEC | WaferStorm M3300 | Single Wafer Solvent Cleaning System | 200 mm | 01.08.2005 | 1 | as is where is | immediately |