PLASMATHERM LAPECVD Large Area PECVD system, used for SiO and SiN process depositions for Sale

For immediate sale: Plasmatherm LAPECVD system
2x Loadlock ports,
2x Process chambers
and DMC/OCR reader
Set up for 150 mm wafer, but can do 100 mm and 200 mm with reconfiguration
Has CE Mark
Currently installed in the cleanroom and running wafers.
Can be inspected by appointment.
See photos for details of the current system condition.
The tool was used for silicon nitride as well as for silicon oxide depositions, the latter being basically an oxide with some fluor in it.
The size of the MFCs is to be found in the table below. Some of the controllers can easily be reprogrammed to a smaller range or configured for use of different gases if needed.
Both chambers of the tool were used for the same depositions. They are esentially identical, except the gas boxes, where PM3 has one MFC less than PM2.

    Gas    SiH4    NH3    He    N2O    SF6    SiF4    N2    Ar
PM2    MFC physical range (sccm)    500    200    5000    5000    1000    1000    5000    5000
    MFC calibration gas    N2    NH3    N2    N2O    SF6    N2    N2    N2
    Gas configured at tool    SiH4    NH3    He    N2O    SF6    SiF4    N2    Ar
    MFC configured gas range (sccm)    300    200    6950    5000    1000    350    5000    6950
                                   
PM3    MFC physical range (sccm)    500    200    5000    5000    1000    500    5000    empty
    MFC calibration gas    N2    NH3    N2    N2O    SF6    N2    N2   
    Gas configured at tool    SiH4    NH3    He    N2O    SF6    SiF4    N2   
    MFC configured gas range (sccm)    300    200    6950    5000    1000    175    5000    0


Manufacturing dates of the chambers:-
September 2014
July 2014
May 2016
October 2016
Available for immediate purchase and removal.

Generic system description:
LAPECVD™
Plasma-Therm’s LAPECVD™ (Large Area Plasma Enhanced Chemical Vapor Deposition) uses a cassette-to-cassette configuration to allow for high-volume production in a wide range of applications.
The LAPECVD™ platform can be used to deposit a variety of thin-film materials with its parallel-plate plasma deposition system.
Hardware
    Cassette-to-Cassette Handling
         - Multi-substrate batch processing
    Dual cassettes
    Platen heating up to 350°C
    Upper electrode RF power at 13.56 MHz with optional MFD
    Up to 8 gas channels with digital MFCs
    Thermally managed reactor design—up to 175°C for internal walls and shower head
Endpoint
    Integrated multifunctional endpoint capability with EndpointWorks.
    Unique OEI application for real-time film thickness and rate monitoring.
    OES for optimized chamber clean.
Software
    User friendly software
    Comprehensive data logging
    Automated cleaning program
    Real-time process data display
    Fully integrated endpoint system
    Factory automation compatible (SECS/GEM)
    Edit recipes during runs
    Multiple user access levels
    Alarm history
Process
    Stress control
    High uniformity
    Low damage
    Low particulates
    Tunable index
    Increased productivity with batch loading capability
    Low temperature