ASML Twinscan XT400F i LINE SCANNER for Sale

The XT:400F is a dual-stage lithographic exposure tool designed for volume 200-mm and 300-mm wafers production down to 220-nm resolution.
The dual wafer stage technology of the XT platform enables the exposure of one wafer and
the alignment and mapping of the next wafer to take place in parallel, thereby virtually eliminating
overhead time and allowing for continuous patterning of wafers. The level sensor, in combination
with the TWINSCAN leveling approach, virtually eliminates differences between inner die and edge
die and ensures high yield across the entire 300-mm wafer.
High throughput and yield are combined with fast reticle exchange times and Lot Streaming to provide the lowest cost of operation.

Lens
Wavelength: 365 nm
NA: 0.48-0.65
Resolution (standard): ≤ 350 nm
Resolution (annular): ≤ 280 nm
Resolution (annular + High Res.): ≤ 220 nm
Field size, for reticle with pellicle
• Max X: 26.0 mm
• Max Y: 33.0 mm
Distortion (Dynamic)
• Conventional:
≤ 30 nm
Overlay
Single-machine (TOP-2): ≤ 12 nm
Matched-machine (TOP-2): ≤ 20 nm