Beta Squared Lithography M700 Mask Aligner for Sale

-This Mask Aligner is still installed in the fab
-It was shut down from operational condition in May 2025
-It has been configured to operate with 150 mm wafer, with major flat.
-It has been upgraded with OS2000 operating system
-It can be inspected by appointment.
-Please refer to the attached photo showing the tool in it's current condition

-A total of qty 3 of these mask aligners are available for purchase.

The Micralign Series Projection Mask Alignment instrument is a
nominally 1:1 annular-field, linear-scan broadband imaging system for
exposing wafers. Optical adjustments can be made and operating
parameters can be selected to permit small deviations from the 1:1
condition for overlay matching to accommodate minor differences in
the size of wafer patterns. The Micralign can process substrates from
as small as 12 mm squares to 150 mm round SEMI standard
substrates.
The Projection Optics function over a wide range of wavelengths, from
deep UV to visible, 240-436 nanometers. By means of the selectable
compensating filter, the spectral characteristics of the illumination can
be tailored to various photoresists.
The uniformity of the illumination can be monitored with a built-in
uniformity tester. An adjustable slit can be set to compensate for non-
uniformities within the mercury (Hg) lamp.
The Projection Optics consists of four mirrors and four corrective
lenses. The corrective lenses also function as windows, sealing the
optical system against adverse environments.
A split-field binocular head microscope with selectable magnifying
elements provides a high-contrast full-color view of the mask patterns
imaged on the wafer. The microscope permits low-power viewing for
row–and-column alignment, as well as high power viewing for fine
alignment. Automatic Fine Alignment (AFA) is available when selected
by the user.Basic Machine Performance Specifications
Resolution
1.25μm lines and spaces, UV-4 (340-440nm)
1.0μm lines and spaces, UV-3 (300-350nm)
Machine to Machine overlay
±0.25μm, 125/100mm systems, 98% of data
±0.30μm, 150mm systems, 98% of data
Machine to Itself overlay
±0.25μm, 98% of data
Throughput
120 wafers per hour, 125/100mm systems
100 wafers per hour, 150mm systems
Depth of Focus
± 6μm for 1.5μm lines and spaces
Focus Stability
± 2.0μm over 6 days
Focus Range
±200μm
±450μm w/ extended bellows chuck (Only available w/ OS2000)
Partial Coherence
Variable, 0.37 to 0.86
Numerical Aperture
.167
Uniformity of Illumination
±3.0%
Particulate Generation
≤ 7 particles per wafer pass (1.0μm or larger)
Prealignment and First-Level Placement Accuracy
±15μm
Footprint
18.65 sq. ft. (1.732 sq. M)
Wafer / Substrate Sizes Standard
100mm, 125mm, 150mm (other configurations available on special order)
This tool has the following support equipment: Air Cooler 39,000 BTU 220 Vac 3 phase