NEUTRONIX QUINTEL NXQ8000AL Mask Aligner, New and Unused for Sale

-purchased new in 2018

-never used

-stored at the warehouse - see attached photo of the tool in storage

-Power requirements: 208 VAC, 3 Phase, 60 Hz 40 A

https://neutronixinc.com/products/mask-aligner-products/nxq8000-series-mask-aligner/
NxQ 8000 Auto Load Series – Scalable, High Volume Production Platform

The NxQ 8000 Auto Load Production Mask Aligner Integrates the latest in Robotic Automation with a state of the art next generation design from Milara, Inc.

The Dual Arm Robot delivers lightning fast wafer transfer at twice the accuracy of competitors and incorporates a pre-aligner from Logosol which can detect transparent substrates making it ideal for not only silicon, but a wide range of compound semiconductor materials. It is a WTS combination that is by far the best in the industry.

The NxQ 8000 Auto Load Alignment Stage utilizes the latest in linear motion technology. With encoder feedback loops measuring actual stage position (not motor position), the vision system is not limited by the hardware, allowing for alignment accuracies of less than 0.5um 3 sigma. This accuracy is achieved using our Quadcam Microscope with 5x objectives, delivering an ideal combination of magnification, field of view and depth of focus.

The NxQ 8000 Auto Load Series Mask Aligner is ideal for Microelectronics, LED / HB LED, 3D IC, SIOP, WLP, 2.5D Interposer, MEMS, BioMEMS, MicroFluidics, Compound Semi, Solar (HCPV), and Optoelectronics applications.

Standard Features
-Wafer sizes from Pieces up to 200mm diameter Manual Load, 50mm up to 200mm Robot Load
-Standard on Auto Load Systems:
    State of the art dual arm robot from Milara Corporation
    Logosol Pre-Aligner – detects opaque, semitransparent and transparent wafers
    Up to Four software configurable cassette I/O stations
    Quadcam Microscope – Two high resolution CCD cameras per objective, switch between Wide View and High Magnification without refocusing
    Production Enclosure

-Windows based menu driven Graphical User Interface (GUI)
-Fully Motorized X-Y-θ Alignment, controlled with electromagnetic linear motors
-Automatic Alignment with Smart Align Technology
-Motorized top and bottom microscopes with recipe stored positions
-LED thru objective illumination with recipe stored intensity settings
-Easy manual tray-load for loading wafers or pieces
-Multiple contact and proximity exposure modes

Optional Features
-Automatic Filter Insertion – Recipe Set
-Synthetic Pattern Input
-Integrated bar code reader
-SECS / GEM Software
-Optical Backside Alignment and Backside Infrared (IR)
-Ring Illumination for oblique and dark field illumination
-UV-LED exposure optics
-500 Watt / 1KW Constant Power / Constant Intensity Lamp House and power supply
-Heated Wafer Chuck and Mask Holder
-Automated mask changing

Detailed Performance Specifications
-Exposure Modes: Soft, Pressure, Vacuum Contact and Proximity Printing Modes
-Print Resolution:

    Proximity – 3um at 20um gap
    Soft Contact – 2um
    Hard Contact – 1um
    Vacuum Contact – 0.6um

Cycle Time and Alignment Accuracy (3 sigma)

    First Mask Mode 130+ wph
    TSA Auto Align Mode (Contact) +/-0.5um 110+ wph
    TSA Auto Align Mode (Proximity) +/-0.5um 110+wph
    BSA Auto Align Mode (Contact) +/-0.75um 100+wph
    BSA Auto Align Mode (Proximity) +/-0.75um 100+wph

Substrate Size: Up to 8”, Up to 10mm thick
Mask Size: 3” X 3” up to 9” X 9”; Mask Adaptors are available for smaller Masks
Alignment Stage

    Alignment Travel X-Y and Theta Motorized with automatic re-centering
    X-Y Movement: +/- 4mm, 100nm resolution
    Theta Rotation Range: +/- 7.5 degrees, 4x10e-5 resolution
    Mask/ Wafer separation: 0 – 1000um with 1um resolution