SUSS Microtec ACS200 Gen 3 Photoresist Coater and Developer Track for Sale

For immediate sale: A SUSS MicroTec Automatic Coater SUSS ACS200 Gen3.

-Currently De-installed & Warehoused.
-Can be inspected by appointment at the warehouse
-This equipment was in working condition before removal.
-No missing or broken parts are recorded
-You are welcome to inspect this system to confirm current condition and configuration.
-Please refer to the photos attached, showing the system before removal.
-Includes 2x Spin Coaters & 2x Developers
-Print Manuals: Included
-CD Manual: Documentation Update Technical Schematics Rev 2 1904 included
-2018 Pre-Owned Equipment
-Vintage Dec 2018
-CE Marked
Electrical Power rating: 400V 3 phase + N + PE, 19KVA 50 Hz
-AIC: 100kA / 400 VAC
-FLC: 30.5 A SCCR: 5kA
-Max single load: 10A
-Chiller: Julabo FC30C

-Configured for 8 inch wafers
-Cassette stations: 4 x 8 inch Open cassette loading
-Wafer Transfer System: 1 x Dual arm Nidec-Sanyo
-Pre-aligner: Equipped with orienter for flat/notch position of Opaque and Glass wafers.
-Bake Plates: Qty 8, Temperature range 60-225 celcius, with possibility of proximity bake.
-Cool Plates: Qty 3, Temperature range 18-25 celcius, with proximity supported.

Chemical Usage History
Cup cleaning: PGMEA
Wafer edge rinse: Acetone
Pre-wet: PGMEA, Acetone, adhesion promoter
Resist Line 1 AZ Positive Type
Resist Line 2 JSR Negative Type
Resist Line 3 TOK Chemically Amplified Type
Resist Line 4 Low Viscosity

Spin Coat Module 1
Open Coater System
Automatic Dispense Arms (2 units)
Wafer Chuck (Designed for 8-inch compatibility)
Process Cup Rinse
Edge Bead Remover (EBR) 
Automatic Solvent Paddle 
Dispense and Nozzle Cleaning
Automatic Resist Dispense 1 (Applicable viscosity: 30 to 800cp)
Automatic Resist Dispense 2 (Applicable viscosity: 400 to 800cp)
Automatic Resist Dispense 3 (Applicable viscosity: 800 to 10,000cp) 
Automatic Resist Dispense 4 (Applicable viscosity: up to 10cp)
Dispense systems for items 1, 2 and 3 use the SUSS Dispense System
Dispense system for item 4: CPD Pressure Feed

Spin Coat Module 2
Open Coater System
Automatic Dispense Arms (2 units)
Wafer Chuck (Designed for 8-inch compatibility)
Process Cup Rinse
Edge Bead Remover (EBR) 
Automatic Solvent Paddle 
Dispense and Nozzle Cleaning
Automatic Resist Dispense 1 (Applicable viscosity: 30 to 800cp)
Automatic Resist Dispense 2 (Applicable viscosity: 400 to 800cp)
Automatic Resist Dispense 3 (Applicable viscosity: 800 to 10,000cp) 
Automatic Resist Dispense 4 (Applicable viscosity: up to 10cp)
Dispense systems for items 1, 2 and 3 use the SUSS Dispense System

Alkaline Developer 1
Wafer Chuck (Designed for both 6 and 8 inch wafers)
Paddle Dispense Nozzle ‒ 1 line 
Binary Spray Nozzle ‒ 1 line 
Top Side Rinse
Back Side Rinse
Developer Temperature Control

Alkaline Developer 2
Wafer Chuck (Designed for both 6 and 8 inch wafers)
Paddle Dispense Nozzle ‒ 1 line 
Top Side Rinse
Back Side Rinse
Developer Temperature Control

ACS200Gen3 Main Unit (5 Modules) 1 unit
Resist Storage Unit 2 units
Media Cabinet 3 units
CI Box 1 unit
Step-Up Transformer 1 unit
Chiller (for developer solution temperature control) 1 unit
Chiller (for cooling plate) 1 unit
Waste Liquid Container Tray 2 units