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ASML XT 1250D DUV lithography ArF scanner, 193 nm for Sale


fabsurplus.com is pleased to announce the availability of the following listed used ASML XT 1250D DUV lithography ArF scanner, 193 nm. This ASML XT 1250D DUV lithography ArF scanner, 193 nm is available for immediate sale. Please click on the "More Details" button if you'd like to get more details, photos and specifications of this DUV lithography ArF scanner, 193 nm and your request will be forwarded to our customer representatives automatically. Crating, refurbishment and delivery can be quoted on request.


ASML XT 1250D Equipment Details

SDI ID: 82174
Manufacturer: ASML
Model: XT 1250D
Description: DUV lithography ArF scanner, 193 nm
Version: 300 mm
Vintage:
Quantity: 1
Sales Condition: as is where is
Lead Time: immediately
Sales Price (each): 2,300,000 USD
Comments:
ASML TWINSCAN XT 1250D ArF SCANNER
Configuration Items:
Track Pre-warning signal (APR)s: APR enabled
Avoid Track INPUT/OUTPUT conflicts, Raise AS after APRs: Avoid Track
INPUT/OUTPUT conflicts enabled
Active wafer release for dry WSs: FALSE
Closing disk types: No closing disk present
Safeguard to prevent loading of reticles with too wide or mispositioned pellicles: Disabled
Continuous clampable wafer table for dry WSs: Absent
Type of wafer table on chuck 1 & 2 for immersion machines: Zerodur version 1
WS Immersion throughput packages: None
WS Immersion thermal control packages: None
Wafer Stage Configurations: Wafer Stage type 2 configuration
Wafer Carrier Locations: Right
Wafers per Carriers: 25
Wafer Mark Sensors: Absent
Wafer Id Readers: Absent
Wafer Sizes:300mm
Wafer Tracks: Present
Wafer Stage Types: Dual Chuck
Wafer Stress Relaxations: FALSE
Lower Docking Plates: Present
WS Balance Masss: Stainless Steel
WH Robot Power Amplifiers: CPM 20
Wafer Stage Fast Stiff X Move Electronicss: Present
Wafer Stage Mirror Block Down Electronicss: Present
Universal Prealignments: Disabled
Interferometer axis version at exposures: 3 plus 1 axis
Wafer Handling Pneumaticss: Dedicated
Wafer Switchs: Absent
Chuck 1 & 2 wafer sizes: 300mm
Type of immersion hood for immersions: None
Specifies chuck1 & 2 layout relev. for Immersions: Chuck does not support immersion
Specifies chuck1 & 2 configs: Dry
Specifies chuck1 & 2 versions: not specified
Changed Short Stroke diff XY controllers: Disabled
Docking wheels at WH unloads: Present
Docking plate heights: Low
Immersion Hood versions: AbsentCarrier Handler Types: Mark I 300 Foup
Wafer Handling Load & Unload Robot Types: Double Fold Arm, 12 mm Z stroke
Wafer Handling Store Units: Absent
Wafer Handler wrt BF Shifted in Zs: Not Shifted
Reticle streaming lites: Disabled
Enhancements in Reticle Monitors: no enhancements
Reticle streaming: Disabled
Improvements for reticle handlings: Disabled
Extend IRIS maximum particles scanned to 50000.s: Absent
Zeroing type for Encoders Measurement Systems: Using extra hall sensors for zeroing
Reticle Stage Chuck Types: Glued Leafspring, TYPE_2: Glued LS, Pneum. GC, IFM / ENC
Nitrogen purging of Reticle Stages: RS is not purged
Reticle Carrier Locations: Right
Integrated Reticle Inspection Systems: PPD1 with IRIS1 functionality
Integrated Reticle Librarys: IRL with original functionality
Reticle Sizes: 6 inch
Reticle Carrier Tag Readers: Present
Reticle Stage Long Stroke Motor Types: Cobalt Ferro 18 teeth
Reticle Stage Long Stroke Configs: TYPE_3:CoFe_18 motor, SB controlled, int. vacuum
supply, pneum GC
Automated Reticle Transport Systems: Absent
Reticle Stage Lenscooler Boxes: Lenscooler Box with anti-aliasing Filter
Maximum Reticle ID Lengths: 24 Characters
Reticle Stage Measurement System on Scans: Heidenhain Encoders
Relative direction of ws to rs on the X axiss: Same
RS Object Fields: Normal
Reticle exchange types: Retex option: E
Iris feature Scans: Absent (Overrules Absent)
Reticle Handler types: Original
2D Barcode Readers: Absent
Integrated Reticle Inspection System Configurations: Disable creation of OSIRIS viewable
files.
WS Immersion Hood Only Testrigs: Absent
Version of RS/WS IO librarys: Version 1
Dynamic Performance Calculations: Mark 1
Stages Sample Rates: 5.0 kHz
Interferometer Electronics: Ifsr
Capacitive z-height sensor type.s: Dual Z sensor board
Ifm config at measure sides: 8 axes
Dose System Performance Test sequences: Test sequence 1
PEP-ADC Intensitys: Disable PEP-ADC Intensity
Online Lamp Peak: Disable Online Lamp Peak
Dose Intensity Optimizations: Dose Intensity OptimizationLaser Gas Life extensions: Disable Laser Gas Life extension
Type of multi foil lens elements: none
Depolarizer types: fixed depolarizer present
PSE & PCE Locations: not applicable
Intensity Calibration Per DOEs: Disabled
Pupil qualification methods: Centre of gravity method
Polarized illumination amorph DOE: Only unpolarized illumination
Fresnel corrections for WSSSs: Disabled
Is NA accuracy measurement allowed: Disabled
Exchangeable Pupil Lens Elements: No EPLE
Multifunction Active Lens Elements: 0
Multifunctional Active Elementss: 0
Use Sigma Calibrations: no Sigma Calibration
Use Sigma WIP Preserving Offsetss: no Sigma WIP Preserving Offsets
THFFC FDE model lens dependents: Disabled
TIS diffusers: absent
Determination of NA ellipticitys: Disabled
XML output for LITHOGUIDEs: Disabled
Use validity ranges around UIP data when Enabled: Use exact matching for UIP data
Number of EXLE elements: 0
Functional use of Active Elements: ALE function as ALE
Polarization Shaping Element Retractors: No PSER hardware installed in the machine
Method for alignment of the laser beams: Align the beam by minimizing the uniformity tilt
over the slit (LUBF)
Pupil TIS angular sensitivity calibration and corrections: TIS Pupil Measurement will not be
improved
Describes at what plane the BMU measures: BMU readings are directly used as if they
are at DOE1 plane
Lens Types: 12
Light-source Architectures: Laser
Light-source Types: Cymer Laser: XLA 165
Light-source Wave-lengths: 193nm
DOSEMAPPERs: Present
DOSE_MAPPER_1s: Present
REMA architectures: REMA C
Illuminator Types: 120
Zoom Axicon Architectures/ Types: ZZA/120
NA Control Architectures/ Types: NA2 Torlon/ 120
Automated DOE Exchangers/ Architectures: Present/ 5 slots MIP Control
UNICOMs/ Architectures: Present/ 1 Motor
Test Tables: Absent
Imaging Electronics Architectures: B Architecture
Attenuator Types: VariableTest Table Z Axiss: Worm Wheel
PUPICOMs/ Architectures: Present/ DC Motor with gearbox
Number of Z Lens Manipulatorss: 5
Number of Active Lens Elementss: 1
Number of Bi-directional Active Lens Elementss: 0
Number of Active Manipulator Elementss: 0
Number of Active Elementss: 1
Number of Half Dome Mirrorss: 0
Number of Semi-Active X-Y Lens Manipulatorss: 4
Setup sensor board versions: Setup SSD version 1
Imaging Generic Power Amplifiers: Generic Power Amplifier
Imaging Control Rack Configurations: IPDR
Type of projection multiplexer boards: MUX Absent
LEC Rack in Electronic Architectures: Present
Projection GPA Configuration Versions: Version 2
Number of Lens NEXZ Manipulatorss: 5
Number of Lens Z Manipulators Using Camdisks: 0
Spotsensor surface coatings: Bilatal
Energy Sensors: VLOC
Spot Sensor Chuck 1s & 2s: VLOC
Modelling for MAXYSs: Absent
Uniformity Improvement Packages: Present
Number of pre-amps available per Z-manipulators: 0
Immersions: Absent
Pupil measurements with ILIASs: Present
Automatic CUAs: Absent
Beam Controls: Beam adjustment
Extended Spot Sensor Matchings: Present
Number of Rxms/ Ryms: 5/5
Diaphragm Limiters: Absent
NA1 motor types: None
Spot Sensor Reticle Stages: Absent
Smooth Field Uniformitys: Absent
Exchangeable Last Lens Elements: Present
Exchangeable Pupil Lens Elements: Absent
Number of manipulable ELLE axess: 0
UV Shutter versions: UV Shutter version 1
Dosecontrol Hardwares: ISB
Illuminator platforms: Aerial 2
Polarizations: Absent
Automatic PCE exchangers: Absent
Automatic CUA exchanger architectures: Not applicable
Test table architectures: Aerial 2Illumination modes: All illumination modes
DUV Lightsource Power Levels: 45.00 Watt
Lens Top Tool Connections: Lens Top Tool can be mounted on top of the Lens
Scanning Energy Sensor Calibrations: Static Energy Sensor Calibration
Position of Spot Sensor on Chuck 1s: Spot Sensor Position on Chuck 1 layout 1
Position of Spot Sensor on Chuck 2s: Spot Sensor Position on Chuck 2 layout 1
Z-capture for low relfectivity wafers: Off
TIS plate deformation corrections: Disabled
FSM Flexibility packages: Disabled
Field width optimised leveling: Disabled
Constrained fits: Disabled
Levelling throughput improvement on measure sides: No levelling throughput package
Point-to-Point LS Machine Matchings: Disabled
Circuit Dependent FECs: Present
Focus Monitorings: Present
Extended LS areas: Disabled
Air Gauges: Absent
Type of Air Gauges: No Air Gauge device present
Reticle shape corrections: Disabled ( Overrules Enabled )
LS focus nodes: LS focus node 3
Level Sensor Processing Racks: LCSR
LS_PEMM_CONFIGs: Present
LS_CPU_CONFIGs: 3 CPU's available
Base Liner overlay high order intrafields: Disabled
BaseLiner focus high order intrafields: Disabled
BaseLiner focus control.s: Disabled
Pattern Matcher fullchips: Absent
Pattern Matchers: Absent
Maximum numerical aperature (NA) that can be used in Lot Productions: level 0
Log missed translations: Disabled
Allow even orders usages: Present
Multilingual UIs: Absent
Improved Maintenance action scheduling.s: Disabled
Recipe Creators: Light
Lot Report Data Categorys: Enhanced Diagnostics
CDCs: Enabled
EFESEs: Absent
PED control modes: Absent
Proximity Matchings: Present
mbds controls: Present
Enhanced exposures 1s: Present
Data collection not covered by FOCUS and OVERLAYs: InformPro Data Collection
disabledOverlay Data Collections: Disabled
XML Lot Report Content Levels: Basic
Enable the Maintenance Assistants: Disable Maintenance Assistant
EDA Interfaces: Disabled
Equipment Constants via SECS interfaces: Disabled
LCI WaitWatcher plug-ins: Absent
Reorder Lot Services: Absent
Shot Data Collections: Absent
Focus Data Collections: Absent
Alignment Recipe Overrides: Disabled
Enable to support SMASH XY mark types.s: not supported
Specifies which mark types are supporteds: ASML marks only
Alignment laser configurations: 2 color laser
OADB Improved Dynamic Ranges: Disabled
board configurations: ODB + ADB
Alignment Camera Mirrors: Absent
Athena Narrow Marks Twinscans: Present
Alignment Sensor Types: Athena Narrow Marks OM
Athena Focus Improvements 1s: Present
Max alignment speeds: Setting 2
AA processing racks: AACR processing rack
Particle Extraction Mass Flow Meters: Absent
purging configurations: purging CONFIG 3
Bubble Extraction Seal Settings: Not Applicable
Ultra Pure Water flow controller (WICC)s: absent
LCW Circuit set-ups: Flow Version 1
In situ Wafer TablesStone Cleanings: Absent
Clean Air Configurations: Others
Metroframe Circuit Water Cabinets: Absent
CT Miscellaneous Racks: Present
Clean Air Temperature Controls: Driver and ACC
Purge Hoods configurations: Compressed Clean air and Extremely Clean Dry air
Nitrogen Purge Utility Controls: Absent
Reticle Cleanings: Absent
Metroframe types: TYPE_I
Inlet restriction for clean airs: Inlet restriction at right side
Reticle Stage purged mini environments: Present
Gas Control Unit Types: High Flow (HF)
Wet Imaging Control Cabinets: Not Applicable
Readout location of Pneumatic Facility Unit sensors: Machine Base Diagnostics System
(MBDS)
Laminar Bottom Hoods: Absent
Extreme Clean Humiditied Airs: AbsentLens Circuit Water Flows: High
Motor Circuit Water Flows: Normal
SPM temp correction for lens axiss: Disabled
2 Sided IFM-beams for WS-X (expose/ measure)s: Not available
Diff pressure correction for IFM beams: Absent
IFM Laser Configurations: AOM Recombo Laser
Position Control Rack Configurations: Rack Configuration type 3
Position Control Power Rack Configurations: TYPE_3: Stages Power Rack upto E-spec
Number of Motion Controllerss: 5 Motion Controllers present
Position Control Motion Control racks: PMCR
Reticle Stage Short Stroke X/Y11/Y12/Y21/Y22/Y11/Y11 amp.s: PADC 100V/16A
Wafer Stage Short Stroke 1 XY1/ XY2/XY3 amp.s: PADC 100V/16A
Wafer Stage Short Stroke 2 XY1/ XY2/XY3 amp.s: PADC 100V/16A
Reticle Stage Short Stroke Z1/Z2/Z3 amp.s: Pass Low Current 8.5A
Wafer Stage Short Stroke 1 Z1/Z2/Z3 amp.s: Pass Low Current 8.5A
Wafer Stage Short Stroke 2 Z1/Z2/Z3 amp.s: Pass Low Current 8.5A
Reticle Stage Long Stroke Y11/Y12/Y21/Y22 amp.s: 450V20A: PAAC AT-pepD
Reticle Balance Mass 1/2 amp.s: 450V20A: PAAC AT-pepD
Wafer Stage Long Stroke E/M X amp.s: 400V16A: PAAC AT-D
Wafer Stage Long Stroke E Y1/Y2/CS amp.s: 400V16A: PAAC AT-D
Wafer Stage Long Stroke M Y1/Y2/CS amp.s: 400V16A: PAAC AT-D
Wafer Stage Balance Mass 11/12/21/22 amp.s: 325V14A: PAAC AT-C
Pressure update rate for fringelength corrections: Pressure update rate 2 or 4 Hz
TestStreams: TestStream disabled
Performance Enhancement Packages: None
PEP Image Streamings: Present
Lot Overhead Reductions: LOR2
Extended Zone Alignments: Disabled
Intrafield Higher Order Process Correctionss: Disabled
SMASH Reuse Capture Information in Stage Alignments: Coarse capture scans are done
on all stage alignment marks.
Allow wafer plane deviation check with Focus Monitorings: Disabled
Parameter indicates how long overlay data will be stored.s: Short retention period.
Level sensor Ry drift corrections: Disabled
Fading Control Switchs: Disabled
Improved wafer reject modes: Disabled
Automated Lens Heating Calibrations: Disabled
Lens heating History in LH Feedforwards: Enabled
Allow different Exp,TIS Align sets: Absent
Imaging Fading Controls: Disabled
Gridmappers: Disabled
2D grid corrections: Enabled
Double TIS scans: DisabledSymmetrical Reticle Alignments: Disabled
Ast offset correction in TIS LHFB/LOCO (Version 3)s: Enabled
Choice of avoidance routing.s: Absent
NEXZ-tilt per exposures: The NEXZ-tilt cannot be adjusted per exposure.
Off-axis slits: Projection lens has no off-axis slit.
Improved Edge Field Levelings: Disabled
Enhanced Throughput Reticle Alignments: Present
Wavelength Adjustables: Adjustable
Allow L1L7 Type 1 Optimizations: Absent
Lot Alignment Report Encryptions: Unencrypted
Stage Alignment Filters: Present
Lot Correction Sequences: Unencrypted
Stage Alignment Filters: Present
Lot Correction Sequences: Type B
Lens Heating Feedbacks: Present
Application Specific Lens Heating Calibration and Verifications: Present
Improved Contrast Controls: Absent
ILIAS lens setups: Absent
Air Gauge Improved Levellings: Absent
Process Dependent Gain Corrections: Absent
Enhanced Exposure Overlays: Absent
ALE 1 Uses: Lens heating only
Overlay Nodes: Level 0
E-chuck Flatness Qualification Tests: Disabled
TOP HDs: Absent
Reticle Align High Precisions: Absent
LS spot coverages: Absent
Layout Version Number TIS Plate 1 on Chuck 1s/2s: TIS Plate 1 Layout Version 2
Layout Version Number TIS Plate 2 on Chuck 1s2s: TIS Plate 2 Layout Version 4
Usage of wavelength/ Energy Sensor data by TISs: Disabled
Indication what kind of AM controller hardware is presents: SUCR
Piezo Active Lens Mountss: Absent
ILIAS Functionality For Lithoguides: Present
ISIS Functionality For Lithoguides: Absent
SAMOS Stray Light Test For Lithoguides: Present
PUPIL Measurement For Lithoguides: Present
FOCAL Measurement for Lithoguides: Present
Leveling Verification Test for Lithoguides: Present
Lithoguide Imaging Recipess: Absent
Dose System Performance Test for Lithoguides: Present
ILIAS Sensor Locations: Chuck 2
ILIAS sensor type chuck 2s: Multiple scan grid
ILIAS sensor type chuck 1s: NoneReticle Level Polarization Sensors: Absent
SASO robustness and fiber connectivitys: Disable SASO robustness
Extended X width masking ranges: Disabled
PDO offset for EFL LS spots: Disabled
Assure System Snapshotss: not allowed
Insert a delay time before starting a Lot (lens heating).s: Enabled
Save throughput data to the disks: Disabled
Patch strategys: Patchlevel
Chuck Dedications: Basic
Application Types: Scanner Application
Number of RMCS clients: No clients
MDL Viewers: Site View
ZERO Fiducials: ILIAS MK2
Machine Architectures: XT Machine Architecture
XT Architecture Revisions: Rev1
Machine Types: 1250
Machine Specifications: pep-D Specification
Stand-alone Workstations: FALSE
CP 1As/1Bs/2s/3s/4s/5s/6s: Absent
Wafer Handler Productivitys: Level 0
Attachments: 0 Files
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