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Hamamatsu C7103 PC Controlled IC Back-side Lapping and Wafer Grinding System for Sale


fabsurplus.com is pleased to announce the availability of the following listed used Hamamatsu C7103 PC Controlled IC Back-side Lapping and Wafer Grinding System. This Hamamatsu C7103 PC Controlled IC Back-side Lapping and Wafer Grinding System is available for immediate sale. Please click on the "More Details" button if you'd like to get more details, photos and specifications of this PC Controlled IC Back-side Lapping and Wafer Grinding System and your request will be forwarded to our customer representatives automatically. Crating, refurbishment and delivery can be quoted on request.


Hamamatsu C7103 Equipment Details

SDI ID: 71907
Manufacturer: Hamamatsu
Model: C7103
Description: PC Controlled IC Back-side Lapping and Wafer Grinding System
Version: 200 mm and packages
Vintage: 01.10.2001
Quantity: 1
Sales Condition: inquire
Lead Time: immediately
Sales Price (each): 19,000 USD
Comments:
The C7103 is a computerised IC backside polishing system for use when preparing a
sample for backside emission analysis or any other analysis technique that requires visualization of the chip internally.
De-installed, warehoused, in Avezzano Italy.
See attached photos for details.

Can be sold "as is", or "as is, operational".
Ce marked.
Main Specifications

Operating Range
X-axis: 250 mm (9-13/16 inch)
Y-axis: 150 mm (5-7/8 inch)
Z-axis: 150 mm (5-7/8 inch)

Resolution
0.01 mm/step (X Y Z)

Interface
Parallel (Centronics)
Serial (RS-232C)

Operating Temperature
5 to 40°C

Operating Humidity
20 % to 75 %

Weight and dimensions:

Weight 150 KG Dims: 134 cm x 134 cm x 75 cm (On wooden base)

Consists of:-
-Main Unit
-8 inch vacuum chuck
-IC Wax holder
-PC (HP Vectra with Windows NT 4.0)
-Hamamatsu s/w V 1.30
-Mouse, Kbd, Monitor
-Power transformer for 240V 1 phase power input
-Power supply unit
-Operation and Maint. manual V1.30
-Control paddle


Attachments: 41 Files
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The data provided herein is not an offer capable of acceptance.
The information contained on this page is, to our knowledge and information, accurate, but it may contain errors and therefore we do not warrant the completeness or accuracy of the information contained on this page.
Any offer by you to purchase the equipment described on this page shall be subject to our standard terms and conditions of sale.

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