SDI fabsurplus.com is pleased to announce the availability of the following listed used Hamamatsu C7103 PC Controlled IC Back-side Lapping and Wafer Grinding System.
Please click on the "Send More Details" button at the end of the C7103 description, if you'd like to get more details, photos and specifications of this PC Controlled IC Back-side Lapping and Wafer Grinding System, and your request for this equipment will be forwarded to our SDI sales representatives automatically.
This Hamamatsu C7103 PC Controlled IC Back-side Lapping and Wafer Grinding System is available for immediate sale.
Crating, refurbishment and delivery for this equipment can be quoted on request.
|Description:||PC Controlled IC Back-side Lapping and Wafer Grinding System|
|Version:||200 mm and packages|
|Sales Price (each):||19,000 USD|
The C7103 is a computerised IC backside polishing system for use when preparing a
sample for backside emission analysis or any other analysis technique that requires visualization of the chip internally.
De-installed, warehoused, in Avezzano Italy.
See attached photos for details.
Can be sold "as is", or "as is, operational".
X-axis: 250 mm (9-13/16 inch)
Y-axis: 150 mm (5-7/8 inch)
Z-axis: 150 mm (5-7/8 inch)
0.01 mm/step (X Y Z)
5 to 40°C
20 % to 75 %
Weight and dimensions:
Weight 150 KG Dims: 134 cm x 134 cm x 75 cm (On wooden base)
-8 inch vacuum chuck
-IC Wax holder
-PC (HP Vectra with Windows NT 4.0)
-Hamamatsu s/w V 1.30
-Mouse, Kbd, Monitor
-Power transformer for 240V 1 phase power input
-Power supply unit
-Operation and Maint. manual V1.30
Send Me More Details about this item.
The data provided herein is not an offer capable of acceptance.
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Any offer by you to purchase the equipment described on this page shall be subject to our standard terms and conditions of sale.
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